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参数资料
| 型号： | C5750X7T2J474M/SOFT |
| 厂商： | TDK Corporation |
| 文件页数： | 15/16页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.47UF 630V 20% X7T 2220 |
| 特色产品： | C-Series Mid Voltage MLCCs Soft Termination MLCC |
| 标准包装： | 1 |
| 系列： | C |
| 电容： | 0.47µF |
| 电压 - 额定： | 630V |
| 容差： | ±20% |
| 温度系数： | X7T |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | Boardflex 敏感 |
| 封装/外壳： | 2220（5750 公制） |
| 尺寸/尺寸： | 0.224" L x 0.197" W（5.70mm x 5.00mm） |
| 厚度（最大）： | 0.110"（2.80mm） |
| 特点： | 软端子 |
| 包装： | 标准包装 |
| 其它名称： | 445-6842-6 |
Packaging
Information
? Carrier Tape Configuration
CSeries–SoftTerminationType
Bulk
160mm min.
Drawing direction
Chips
Bulk
160mm min
Leader
400mm min
? Peel Back Force (Top Tape)
Carrier tape
Top cover tape
Direction & angle of pull
0.05 – 0.7 N
0~15 °
? Carrier tape shall be flexible enough to be
wound around a minimum radius of 30mm with
components in tape.
? The missing of components shall be less than
0.1%
? Components shall not stick to the cover tape.
? The cover tape shall not protrude beyond the
edges of the carrier tape and shall not cover the
sprocket holes.
? Chip Quantity Per Reel and Structure of Reel (Paper & Plastic)
Paper Carrier Tape & Reel
Top cover tape
Pitch hole
Plastic Carrier Tape & Reel
Top cover tape
Pitch hole
Bottom cover tape
Paper carrier tape
Plastic carrier tape
10,000
Case Code
JIS EIA
C2012 CC0805
Chip
Thickness
0.85 mm
1.25 mm
Taping Material
Paper/Plastic
Plastic
Chip quantity (pcs.)
φ178mm (7”) reel φ330mm (13”) reel
4,000
2,000
C3216
CC1206
1.15 mm
1.30 mm
Plastic
2,000
10,000
1.60 mm
8,000
1.60 mm
2,000
8,000
C3225
CC1210
2.00 mm
2.30 mm
Plastic
1,000
5,000
2.50 mm
2.00 mm
1,000
C4532
C5750
CC1812
CC2220
2.30 mm
2.50 mm
2.30 mm
2.50 mm
Plastic
Plastic
500
500
3,000
3,000
TDK MLCC US Catalog
Page 177
Version B11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| C5750X7T2W103M | 制造商:TDK 制造商全称:TDK Electronics 功能描述:Multilayer Ceramic Chip Capacitors |
| C5750X7T2W105K | 功能描述:多层陶瓷电容器MLCC - SMD/SMT RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C5750X7T2W105K/SOFT | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 2220 450V 1.0uF X7T Boardflex Sensitive RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| C5750X7T2W105K250KA | 制造商:TDK 功能描述:CAP 1UF 450V X7T +/-10% SMD 2220 - Tape and Reel 制造商:TDK 功能描述:CAP CER 1UF 450V 10% X7T 2220 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C5750, T.C:X7T, Voltage:2W, Cap Value:105, Tol:K, Thickness:2.5, E series: 1 |
| C5750X7T2W105K250KE | 制造商:TDK 功能描述:CAP 1UF 450V X7T 10% SMD 2220 - Tape and Reel 制造商:TDK 功能描述:CAP CER 1UF 450V 10% X7T 2220 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C5750, T.C:X7T, Voltage:2W, Cap Value:105, Tol:K, Thickness:2.5, E series: 1 |
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