参数资料
| 型号： | C850-180-WHX |
| 厂商： | Bourns Inc. |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | CIRCUIT PROT 180MA 850VIMP TBU |
| 产品培训模块： | Transient Blocking Units |
| 标准包装： | 40 |
| 系列： | TBU™ |
| 电压 - 工作： | 425V |
| 技术： | 混合技术 |
| 电路数： | 1 |
| 应用： | 通用 |
| 封装/外壳： | 0.325" L x 0.157 " W x 0.033" H（8.25mm x 4mm x 0.85mm） |
| 供应商设备封装： | 3-DFN |
| 包装： | 管件 |
| 工具箱： | TBU-DESIGNKIT-ND - KIT SURGE SUPP 18DEVICES 10EACH |
C650 and C850 Series TBU ? High-Speed Protectors
Product Dimensions
K
Dim.
Min.
Typ.
Max.
B
C
J
K
E
F
E
J
N
A
3.90
(.154)
4.00
(.157)
4.10
(.161)
A
3
2
1
H
B
C
8.15
(.321)
0.80
(.031)
8.25
(.325)
0.85
(.033)
8.35
(.329)
0.90
(.035)
D
0.000
(.000)
0.025
(.001)
0.050
(.002)
PIN 1
TOP VIEW
Recommended Pad Layout
D
SIDE VIEW
BOTTOM VIEW
N
E
F
H
2.55
(.100)
1.10
(.043)
3.45
(.136)
2.60
(.102)
1.15
(.045)
3.50
(.138)
2.65
(.104)
1.20
(.047)
3.55
(.140)
0.70
(.028)
1.15
(.045)
Pad Designation
Pad # Apply
J
K
0.20
(.008)
0.65
(.026)
0.25
(.010)
0.70
(.028)
0.30
(.012)
0.75
(.030)
2.625
(.103)
1
2
In/Out
NC
N
0.20
(.008)
0.25
(.010)
0.30
(.012)
3.55
(.140)
3 In/Out
NC = Solder to PCB; do not make electrical
DIMENSIONS:
MM
(INCHES)
connection, do not connect to ground.
TBU ? protectors have matte-tin termination ?nish. Suggested layout should use non-solder mask de?ne (NSMD). Recommended stencil thick-
ness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any
power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For minimum parasitic capacitance, do not allow
any signal, ground or power signals beneath any of the pads of the device.
Thermal Resistances
Symbol
R th(j-a)
Parameter
Junction to leads (package)
Value
116
Unit
°C/W
Re?ow Pro?le
Pro?le Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat
- Temperature Min. (Tsmin)
- Temperature Max. (Tsmax)
- Time (tsmin to tsmax)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classi?cation Temperature (Tp)
Time within 5 °C of Actual Peak Temp. (tp)
Ramp-Down Rate
Time 25 °C to Peak Temperature
Pb-Free Assembly
3 °C/sec. max.
150 °C
200 °C
60-180 sec.
217 °C
60-150 sec.
260 °C
20-40 sec.
6 °C/sec. max.
8 min. max.
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications.
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