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参数资料
| 型号： | C9320-03TL |
| 厂商： | ARIES ELECTRONICS INC |
| 元件分类： | 插座 |
| 英文描述： | DIP20, IC SOCKET |
| 文件页数： | 1/1页 |
| 文件大小： | 164K |
| 代理商： | C9320-03TL |
Series C84/93 LO-PRO
file Dual
Beam Solder Tail Edge-Grip Sockets
Note: Aries specializes in custom design and production. In addition to
the standard products shown on this page, special materials, platings,
sizes, and configurations can be furnished, depending on quantities.
Aries reserves the right to change product specifications without notice.
FEATURES:
Anti-wicking design on LO-PROfile sockets eliminates flux or sol-
der contamination.
Dual beam, edge-grip contacts provide high retention and positive
contact.
End-to-end and side-to-side stackable.
SPECIFICATIONS:
Body is black UL-94V-0 Glass-filled Nylon 4/6.
Dual beam contact is Phosphor Bronze Alloy 521.
Contact plating: (all over 50
μ” [1.27μm] Nickel per SAE-AMS-QQ-
N-290)
Tin = 200
μ” [5.08μm] min Matte Tin per ASTM B545-97.
Tin/Lead = 100-150
μ” [2.54-3.81μm] min. 90/10 Tin/Lead per
MIL-P-81728.
Gold = 10
μ” [0.25μm] min. Gold per MIL-G-45204 in contact area
and 100-150
μ” [2.54-3.81μm] min 90/10 Tin/Lead per MIL-P-
81728 on Solder Tail
Wafer is Nomex, .005 [.13] thick.
Contact current rating=1 Amp.
Contact resistance=20 mOhms initial.
Insulation resistance=100 MOhms @ 500 VDC per
MIL-STD-1344, method 3003.1.
Dielectric withstanding voltage=1000 VAC.
Operating temperature= -67°F to 221°F [-55°C to 105°C] Tin
= -67°F to 257°F [-55°C to 125°C] Gold
Accepts leads up to .011 x .018 ± .003 [.28 x .46 ± .08] or .021
[.53] diameter.
Accepts leads .070-.135 [1.78-3.43] long.
Mounting Considerations:
Suggested PCB hole size=.036± .002 [.91 ± .05] dia.
ORDERING INFORMATION
All tolerances ± .005 [.13]
unless otherwise specified
ALL DIMENSIONS: INCHES [MILLIMETERS]
No. of Pins
Dim “A”
Dim. “B”
Centers “C”
Dim. “D”
Dim. “E”
Dim. “F”
6
.290 [7.37]
.200 [5.08]
.300 [7.62]
.395 [10.03]
---
8
.390 [9.91]
.300 [7.62]
.395 [10.03]
---
14
.690 [17.53]
.600 [15.24]
.300 [7.62]
.395 [10.03]
---
.350 [8.89]
16
.790 [20.07]
.700 [17.78]
.300 [7.62]
.395 [10.03]
---
.400 [10.16]
18
.890 [22.61]
.800 [20.32]
.300 [7.62]
.395 [10.03]
---
.450 [11.43]
20
.990 [25.15]
.900 [22.86]
.300 [7.62]
.395 [10.03]
---
.500 [12.70]
24
1.190 [30.23] 1.100 [27.94]
.300 [7.62]
.395 [10.03] .400 [10.16]
---
24
1.190 [30.23] 1.100 [27.94] .600 [15.24] .695 [17.65] .400 [10.16]
---
28
1.390 [35.31] 1.300 [33.02] .600 [15.24] .695 [17.65] .500 [12.70]
---
40
1.990 [50.55] 1.900 [48.26] .600 [15.24] .695 [17.65] .500 [12.70] 1.000 [25.40]
CONTACT DETAIL
6 pin socket
is closed
frame as
shown
12001
REV.D
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
NORTH AMERICA
Frenchtown, NJ USA
TEL: (908) 996-6841
FAX:(908) 996-3891
EUROPE
TEL: +44 870 240 0249
FAX: +44 871 919 6033
europe@arieselec.com
http://www.arieselec.com info@arieselec.com
abc
WAFER ON
UNDERSIDE
OF SOCKET
C XX XX- XX TL
Series
Pin plating:
93= Gold
84= Tin
No. of pins
(see table)
-02= Nomex wafer
(standard)
-03= 24 pin on .300
center (comes
with wafer)
Plating Option:
Tin/Lead
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| C9322-02 | 功能描述:IC 与器件插座 LO-PROFILE 22 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| C9324-02 | 功能描述:IC 与器件插座 LO-PROFILE 24 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| C9324-03 | 功能描述:IC 与器件插座 24P SOCKET GOLD RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| C9328-02 | 功能描述:IC 与器件插座 LO-PROFILE 28 PINS MYLAR WAFER GOLD RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
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