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参数资料
| 型号： | CA3282AS1 |
| 厂商： | INTERSIL CORP |
| 元件分类： | 外设及接口 |
| 英文描述： | Octal Low Side Power Driver with Serial Bus Control |
| 中文描述： | 1 A 8 CHANNEL, SIPO BASED PRPHL DRVR, PZFM15 |
| 封装： | PLASTIC, MO-048, SIP-15 |
| 文件页数： | 7/10页 |
| 文件大小： | 65K |
| 代理商： | CA3282AS1 |
7
For the CA3282, the maximum positive output current rating
is 1A when one output is ON. When ALL outputs are ON, the
rating is reduced to 0.625A because the total maximum cur-
rent is limited to 5A. For any given application, all output driv-
ers on a chip may or may not have a different level of
loading. The discussion here is intended to provide relatively
simple methods to determine the maximum dissipation and
current ratings as a general solution and, as a special solu-
tion, when all switched ON outputs have the same current
loading.
General Solution
A general equation for dissipation should specify that the
total power dissipation in a package is the sum of all signifi-
cant elements of dissipation on the chip. However, in Power
BiMOS Circuits very little dissipation is needed to control the
logic and predriver circuits on the chip. The over-all chip dis-
sipation is primarily the sum of the I
2
R dissipation losses in
each channel where the current, I is the output current and
the resistance, R is the NMOS channel resistance, r
DS(ON)
of each output driver. As such, the total dissipation, P
D
for n
output drivers is:
n
∑
This expression sums the dissipation, P
K
of each output
driver without regard to uniformity of dissipation in each
MOS channel. The dissipation loss in an NMOS channel is:
where the current, I is determined by the output load when
the channel is turned ON. The channel resistance, r
DS(ON)
is a function of the circuit design, level of gate voltage and
the chip temperature. Refer to the Electrical Specifications
values for worse case channel resistance.
The temperature rise in the package due to the dissipation is
the product of the on-chip dissipation, P
D
and the package
Junction-to-Case thermal resistance,
θ
JC
. To determine the
junction temperature, T
J
, given the case (heat sink tab)
temperature, T
C
, the linear heat flow solution is:
or
Since this solution relates only to the package, further
consideration must be given to a practical heat sink. The
equation of linear heat flow assumes that the Junction-to-
Ambient thermal resistance,
θ
JA
, is the sum of the thermal
resistance from Junction-to-Case and the thermal resistance
from Case (heat sink)-to-Ambient,
θ
CA
. The Junction-to-
Ambient thermal resistance,
θ
JA
is the sum of all thermal
paths from the chip junction to the ambient temperature (T
A
)
environment and can be expressed as:
Equation 3 and Equation 3A may be expressed as:
or
Not all Integrated Circuit packages have a directly definable
case temperature because the heat is spread thru the lead
frame to a PC Board which is the effective heat sink.
Calculation Example 1
For the CA3282,
θ
JC
= 3
o
C/W and the worst case junction
temperature, as an application design solution, should not
exceed 150
o
C. For any given application, Equation 1 deter-
mines the dissipation, P
D
.
Assume the package is mounted to a heat sink having a
thermal resistance of 6
o
C/W and, for a given application, the
dissipation, P
D
= 3W. Assume the operating ambient tem-
perature, T
A
= 100
o
C. The calculated Junction-to-Ambient
thermal resistance is:
θ
JA
=
θ
JC
+
θ
CA
= 9
o
C/W
The solution for junction temperature by Equation 5 is :
T
J
= 100
o
C + 3W x 9
o
C/W = 127
o
C
Calculation Example 2
Using the CA3282 maximum Junction-to-Ambient Thermal
Resistance,
θ
JA
value of 45
o
C/W (no external heat sink) and
the worst case Junction Temperature, T
C
of 150
o
C we have
an application design solution for the maximum ambient
temperature or dissipation. For example; Using Equation 1
and assuming a device dissipation, P
D
of 1W, the maximum
allowable Ambient Temperature, T
A
from Equation 5A is
calculated as follows:
T
A
= 150
o
C - 1.0W x 45
o
C/W = 105
o
C
Equal Current Loading Solution
Where a given application has equal current loading in the
output drivers, equal r
DS(ON)
and temperature conditions
may be assumed. As such, a convenient method to show
rating boundaries is to substitute the dissipation Equation 2
into the junction temperature Equation 3. For m outputs that
are ON with equal currents, where I = I
1
= I
2
..... = I
m
, we
have the following solution for dissipation:
PD
Pk
k
1
=
=
(EQ. 1)
Pk
I2
rDS ON
(
)
×
=
(EQ. 2)
TJ
TC
PD
θ
JC
×
+
=
(EQ. 3)
TC
TJ
PD
θ
JC
×
–
=
(EQ. 3A)
θ
J
A
θ
JC
θ
CA
+
=
(EQ. 4)
TJ
TA
PD
θ
JA
×
+
=
(EQ. 5)
TA
TJ
PD
θ
JA
×
–
=
(EQ. 5A)
PD
m
Pk
×
m
I
×
2
rDS ON
(
)
×
=
=
(EQ. 6)
I
–
JC
)
-----------------------------------------------------
=
(EQ. 7)
CA3282
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| CA3282 | Octal Low Side Power Driver with Serial Bus Control(串行总线控制的八低边功率驱动器) |
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| CA3290A | BiMOS Dual Voltage Comparators with MOSFET Input, Bipolar Output |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CA3282AS2 | 制造商:harris/intersil 功能描述: 制造商:Harris Corporation 功能描述: |
| CA3290 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:BiMOS Dual Voltage Comparators with MOSFET Input, Bipolar Output |
| CA3290_04 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:BiMOS Dual Voltage Comparators with MOSFET Input, Bipolar Output |
| CA32906-1339 | 制造商:ITT Interconnect Solutions 功能描述:CA3100A10SL-4P-F9(RES) - Bulk |
| CA3290A | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:BiMOS Dual Voltage Comparators with MOSFET Input, Bipolar Output |
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