参数资料
型号: CAT24C64HU4I-GT3
厂商: ON Semiconductor
文件页数: 2/15页
文件大小: 0K
描述: 64KB I2C SER EEPROM UDFN8
标准包装: 3,000
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 64K (8K x 8)
速度: 400kHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-UFDFN 裸露焊盘
供应商设备封装: 8-UDFN(2x3)
包装: 带卷 (TR)
CAT24C64
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameters
Storage Temperature
Voltage on Any Pin with Respect to Ground (Note 1)
Ratings
–65 to +150
–0.5 to +6.5
Units
° C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The DC input voltage on any pin should not be lower than ? 0.5 V or higher than V CC + 0.5 V. During transitions, the voltage on any pin may
undershoot to no less than ? 1.5 V or overshoot to no more than V CC + 1.5 V, for periods of less than 20 ns.
Table 2. RELIABILITY CHARACTERISTICS (Note 2)
Symbol
N END (Note 3)
T DR
Endurance
Data Retention
Parameter
Min
1,000,000
100
Units
Program/Erase Cycles
Years
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC ? Q100
and JEDEC test methods.
3. Page Mode, V CC = 5 V, 25 ° C.
Table 3. D.C. OPERATING CHARACTERISTICS
( V CC = 1.8 V to 5.5 V, T A = ? 40 ° C to +1 25 ° C and V CC = 1.7 V to 5.5 V, T A = ? 40 ° C to +85 ° C, unle ss otherwise speci ? ed.)
Symbol
I CCR
I CCW
Parameter
Read Current
Write Current
Test Conditions
Read, f SCL = 400 kHz
Write, f SCL = 400 kHz
Min
Max
1
2
Units
mA
mA
I SB
Standby Current
All I/O Pins at GND or V CC
T A = ? 40 ° C to +85 ° C
V CC ≤ 3.3 V
1
m A
T A = ? 40 ° C to +85 ° C
V CC > 3.3 V
T A = ? 40 ° C to +125 ° C
3
5
I L
V IL
V IH
V OL1
V OL2
I/O Pin Leakage
Input Low Voltage
Input High Voltage
Output Low Voltage
Output Low Voltage
Pin at GND or V CC
V CC ≥ 2.5 V, I OL = 3.0 mA
V CC < 2.5 V, I OL = 1.0 mA
? 0.5
V CC x 0.7
2
V CC x 0.3
V CC + 0.5
0.4
0.2
m A
V
V
V
V
Table 4. PIN IMPEDANCE CHARACTERISTICS
(V CC = 1.8 V to 5.5 V, T A = ? 40 ° C to +125 ° C and V CC = 1.7 V to 5.5 V, T A = ? 40 ° C to +85 ° C, unless otherwi se speci ? ed.)
Symbol
C IN (Note 4)
C IN (Note 4)
I WP (Note 5)
Parameter
SDA I/O Pin Capacitance
Input Capacitance (other pins)
WP Input Current
Conditions
V IN = 0 V
V IN = 0 V
V IN < V IH , V CC = 5.5 V
Max
8
6
130
Units
pF
pF
m A
V IN < V IH , V CC = 3.3 V
V IN < V IH , V CC = 1.8 V
V IN > V IH
120
80
2
I A (Note 5)
Address Input Current
(A0, A1, A2)
Product Rev F
V IN < V IH , V CC = 5.5 V
V IN < V IH , V CC = 3.3 V
50
35
m A
V IN < V IH , V CC = 1.8 V
V IN > V IH
25
2
4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC ? Q100
and JEDEC test methods.
5. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull ? down is relatively
strong; therefore the external driver must be able to supply the pull ? down current when attempting to drive the input HIGH. To conserve power,
as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x V CC ), the strong pull ? down reverts to a weak current source.
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