参数资料
型号: CAT25640YI-GT3
厂商: ON Semiconductor
文件页数: 3/19页
文件大小: 0K
描述: IC EEPROM 64KB SPI SER 8TSSOP
标准包装: 3,000
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 64K (8K x 8)
速度: 20MHz
接口: SPI 3 线串行
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 8-TSSOP
包装: 带卷 (TR)
CAT25640
Table 4. D.C. OPERATING CHARACTERISTICS ? NEW PRODUCT (Rev F)
( V CC = 1.8 V to 5.5 V, T A = ? 40 ° C to +85 ° C and V CC = 2.5 V to 5.5 V, T A = ? 40 ° C to +125 ° C, unless otherwise specified.)
Symbol
Parameter
Test Conditions
Min
Max
Units
I CCR
Supply Current
(Read Mode)
Read, SO open /
? 40 ° C to +85 ° C
V CC = 1.8 V, f SCK = 5 MHz
V CC = 2.5 V, f SCK =10 MHz
0.2
0.3
mA
V CC = 5.5 V, f SCK = 20 MHz
0.6
Read, SO open /
? 40 ° C to +125 ° C
2.5 V< V CC < 5.5 V,
f SCK = 10 MHz
0.6
I CCW
Supply Current
(Write Mode)
Write, CS = V CC /
? 40 ° C to +85 ° C
V CC = 1.8 V
V CC = 2.5 V
0.8
1.4
mA
V CC = 5.5 V
2
Write, CS = V CC /
? 40 ° C to +125 ° C
2.5 V< V CC < 5.5 V
2
I SB1
I SB2
I L
Standby Current
Standby Current
Input Leakage Current
V IN = GND or V CC ,
CS = V CC , WP = V CC ,
V CC = 5.5 V
V IN = GND or V CC ,
CS = V CC , WP = GND,
V CC = 5.5 V
V IN = GND or V CC
T A = ? 40 ° C to +85 ° C
T A = ? 40 ° C to +125 ° C
T A = ? 40 ° C to +85 ° C
T A = ? 40 ° C to +125 ° C
? 2
1
3
3
5
2
m A
m A
m A
I LO
Output Leakage
Current
CS = V CC
V OUT = GND or V CC
T A = ? 40 ° C to +85 ° C
T A = ? 40 ° C to +125 ° C
? 1
? 1
1
2
m A
V IL
V IH
V OL1
Input Low Voltage
Input High Voltage
Output Low Voltage
V CC > 2.5 V, I OL = 3.0 mA
? 0.5
0.7 V CC
0.3 V CC
V CC + 0.5
0.4
V
V
V
V OH1
V OL2
V OH2
Output High Voltage
Output Low Voltage
Output High Voltage
V CC > 2.5 V, I OH = ? 1.6 mA
V CC < 2.5 V, I OL = 150 m A
V CC < 2.5 V, I OH = ? 100 m A
V CC ? 0.8 V
V CC ? 0.2 V
0.2
V
V
V
Table 5. P IN  CAPACITANCE (Note 4) (T A = 25 ° C, f = 1.0 MHz, V CC = +5.0 V)
Symbol
C OUT
C IN
Test
Output Capacitance (SO)
Input Capacitance (CS, SCK, SI, WP, HOLD)
Conditions
V OUT = 0 V
V IN = 0 V
Min
Typ
Max
8
8
Units
pF
pF
4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC ? Q100
and JEDEC test methods.
http://onsemi.com
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