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| 型号： | CAT4109V-GT2 |
| 厂商： | ON Semiconductor |
| 文件页数： | 2/10页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER RGB 16-SOIC |
| 标准包装： | 1 |
| 恒定电流： | 是 |
| 拓扑： | PWM |
| 输出数： | 3 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 背光 |
| 类型 - 次要： | RGB |
| 电源电压： | 3 V ~ 5.5 V |
| 输出电压： | 25V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 85°C |
| 产品目录页面： | 805 (CN2011-ZH PDF) |
| 其它名称： | CAT4109V-GT2DKR |
CAT4109, CAV4109
VIN
5 V to 25 V
VDD
3 V to 5.5 V
C1
1 m F
RED GREEN BLUE
CONTROLLER
OE
PWM1
PWM2
VDD
LED1 LED2
LED3
PWM3
RSET1
RSET2
CAT4109/CAV4109
RSET3
GND
PGND
R1
R2
R3
Figure 1. Typical Application Circuit
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
VDD Voltage
Input Voltage Range (OE, PWM1, PWM2, PWM3)
LED1, LED2, LED3 Voltage
DC Output Current on LED1 to LED3
Storage Temperature Range
Junction Temperature Range
Lead Soldering Temperature (10 sec.)
ESD RATING
Human Body Model (Note 2)
LV pins (non LEDn pins # 3, 4, 5, 6, 7, 8, 15 and 16)
HV pins( LEDn pins #9, 10 and 11)
Machine Model (Note 3)
LV pins (non LEDn pins # 3, 4, 5, 6, 7, 8, 15 and 16)
HV pins ( LEDn pins #9, 10 and 11)
Rating
6
? 0.3 V to 6 V
25
200
? 55 to +160
? 40 to +150
300
1500
750
200
175
Units
V
V
V
mA
° C
° C
° C
V
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
2. JESD22 ? A114C
3. JESD625 ? A
Table 2. RECOMMENDED OPERATING CONDITIONS
Parameter
VDD
Voltage applied to LED1 to LED3, outputs off
Voltage applied to LED1 to LED3, outputs on
Output Current on LED1 to LED3
Ambient Temperature Range
Range
3.0 to 5.5
up to 25
up to 6 (Note 4)
2 to 175
? 40 to +85
Units
V
V
V
mA
° C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
4. Keeping LEDx pin voltage below 6 V in operation is recommended to minimize thermal dissipation in the package.
http://onsemi.com
2
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