参数资料
型号: CB042D0684JBC
厂商: AVX Corporation
文件页数: 6/10页
文件大小: 0K
描述: CAP FILM 0.68UF 63VDC 2220
产品培训模块: Component Solutions for Smart Meter Applications
产品目录绘图: CB Series
标准包装: 1
系列: CB
电容: 0.68µF
额定电压 - AC: 40V
额定电压 - DC: 63V
电介质材料: 聚乙烯,金属化 - 层叠式
容差: ±5%
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 2220(5750 公制)
尺寸/尺寸: 0.228" L x 0.197" W(5.80mm x 5.00mm)
高度 - 座高(最大): 0.157"(4.00mm)
端子: 焊盘
特点: 通用
包装: 标准包装
产品目录页面: 2086 (CN2011-ZH PDF)
其它名称: 478-4538-6
Film Chip Capacitors
PET-HT DIELECTRIC – CB Series
MOUNTING AND SOLDERING RECOMMENDATIONS
SOLDERING PROFILE
The capacitors can be mounted using infrared and vapor phase soldering following recommended below. They are NOT
suitable for wave soldering.
All temperature refer to topside of the package, measured on the package body surface.
Profile Feature
Ramp-Up (T s max to T p )
Preheat
- Temperature Min (T s min)
- Temperature Min (T s max)
- Time (t s min to t s max)
Time maintained above
2220 to 2824 4030 to 6054
3°C / second max 3°C / second max
150°C 150°C
200°C
200°C
180 sec. max
180 sec. max
T p
T L
T s max
T s min
T p - 5oC
t S
Ramp up
t p
t L
Ramp
down
- Temperature (T L )
- Time (t L )
217°C
60 sec. max
217°C
75 sec. max
Peak temperature (T p )
Time within 5°C of peak
temperature (t p )
240°C
10 sec.
245°C
10 sec.
0
30
60
90
120 150 180 210
Time (seconds)
240
270
300
330
Ramp-Down
6°C / sec.
6°C / sec.
*Reflow soldering referring to JEDEC Standard with some limitations
*JEDEC J-Std 020C
RECOMMENDED SOLDER PASTE THICKNESS
For optimum solderability, the recommended soldering
paste thickness: 2220 to 2824 :150 to 200μm
4030 to 6054 :200 to 300μm
In case of hand soldering, the temperature of the soldering
iron should not be above 250°C. Special care must be taken
to avoid touching the capacitor body with the iron tip.
C
B
PAD DIMENSIONS: millimeters (inches)
Size Code
Case Size
A
B
C
04
05
2220
2824
5.00
6.00
(0.195)
(0.234)
1.90
2.50
(0.075)
(0.098)
4.50
5.70
(0.178)
(0.224)
A
16
17
18
4030
5040
6064
7.50
11.2
14.6
(0.295)
(0.441)
(0.575)
3.00
3.50
3.60
(0.118)
(0.137)
(0.147)
8.00
10.3
12.6
(0.315)
(0.406)
(0.496)
RECOMMENDED CLEANING
To clean flux from the PC board assembly, the recommended
products are: ethanol, isopropyl alcohol, and deionized water
wash. The cleaning products to avoid are: Toluene, Xylene,
Trichloroethylene, Terpene Cleaner EC-7, surface active
agent. In case of using another solvent, please contact us.
OTHER CAUTIONS
Flame retardancy: the dielectric film is not a flame retardant
material.
Environment: contact us when chips are used in humid or
gas atmosphere and /or when using resin.
Recommended handling: do not use edged tools, so not
to damage the capacitors.
TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121
Stress Type
Temperature cycling
Ambient Temperature /
Humidity Storage
High Temperature /
Humidity Storage
Ref. Spec.
JESD22-A104
Test Conditions
-55°C +85(+10/-0)°C air
5 to 10 minutes soak 3 cycles/hour
30+/-2°C - 60+/-3% RH -2000H
70+/-5°C - 93+3/-2% RH -1000H
Analysis
SEM x 1000
SEM x 1000
SEM x 1000
Results
Pass
Pass
Pass
15
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