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参数资料
| 型号： | CB2518T220M |
| 厂商： | Electronic Theatre Controls, Inc. |
| 英文描述： | WOUND CHIP INDUCTORS |
| 中文描述： | 绕线型片式电感 |
| 文件页数： | 11/16页 |
| 文件大小： | 781K |
| 代理商： | CB2518T220M |
203
F
5
RELIABILITY DATA
4/8
At least 90
L
of electrode
Item
Specified Value
Test Methods and Remarks
14.Drop test
L/L
Within
M
5
L
No significant
abnormality in
appearance.
LEM
Drop test
Impact material
concreta or vinyl tile
Height
1m
Total number of drops
10 times
LEM2520
Acceleration
980m/sec
2
Duration
6msec
Number of times
6 sides
P
3 times
Mounting method
Soldering onto printed board
f
* Excluding 10N
V
R10
g
Recovery
At least 1 hr of recovery under
the standard condition after the
test, followed by the measure-
ment within 2 hrs.
LEM
Solder temperature
230
M
5
C
Duration
5
M
0.5sec.
f
LEM2520
g
Fiux
Methanol solution with 25
L
of
colophony
LB
Y
LBC
Y
CB
Y
CBC
Y
CBL
Y
LBH
Solder temperature
230
M
5
C
Duration
5
M
0.5sec
Fiux
Methanol solution with 25
L
of
colophony
15.Solderability
LEM2520
LBH1608
LB2518
LB2016
LB2012
LB1608
LBC2518
LBC2016
LBC2012
CB2518
CB2016
CB2012
CBC3225
CBC2518
CBC2016
CBC2012
CBL2012
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CB-2518T220M-K | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:Surface Mount Ferrite Products |
| CB2518T221 | 制造商:TAIYO-YUDEN 制造商全称:Taiyo Yuden (U.S.A.), Inc 功能描述:WOUND CHIP INDUCTORS |
| CB2518T221K | 功能描述:固定电感器 INDCTR HI CUR WND 1007 220uH 10% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| CB2518T221M | 功能描述:固定电感器 INDCTR HI CUR WND 1007 220uH 20% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| CB2518T2R2M | 功能描述:固定电感器 INDCTR HI CUR WND 1007 2.2uH 20% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
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