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参数资料
| 型号： | CB262E0225JBC |
| 厂商： | AVX Corporation |
| 文件页数： | 15/19页 |
| 文件大小： | 0K |
| 描述： | CAP FILM 2.2UF 100VDC SMD |
| 标准包装： | 900 |
| 系列： | CB |
| 电容： | 2.2µF |
| 额定电压 - DC： | 100V |
| 电介质材料： | 聚乙烯，金属化 - 层叠式 |
| 容差： | ±5% |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 特点： | 通用 |
Film Chip Capacitors
PEN DIELECTRIC – CB Series
MOUNTING AND SOLDERING RECOMMENDATIONS
SOLDERING PROFILE
The capacitors can be mounted using infrared and vapor phase soldering following recommended below.
They are NOT suitable for wave soldering.
All temperature refer to topside of the package, measured on the package body surface.
Profile Feature
Ramp-Up (T s max to T p )
Preheat
- Temperature Min (T s min)
- Temperature Min (T s max)
- Time (t s min to t s max)
Time maintained above
1206 to 1812
3°C / second max
150°C
200°C
180 sec. max
2220 to 6054
3°C / second max
150°C
200°C
180 sec. max
T p
T L
T s max
T s min
T p - 5oC
t S
Ramp up
t p
t L
Ramp
down
- Temperature (T L )
- Time (t L )
217°C
60 sec. max
217°C
75 sec. max
Peak temperature (T p )
Time within 5°C of peak
temperature (t p )
250°C
10 sec.
255°C
10 sec.
0
30
60
90
120 150 180 210
Time (seconds)
240
270
300
330
Ramp-Down
6°C / sec.
6°C / sec.
*Reflow soldering referring to JEDEC Standard with some limitations
*JEDEC J-Std 020C
RECOMMENDED SOLDER PASTE THICKNESS
For optimum solderability, the recommended soldering
paste thickness: 1206 to 2824 :150 to 200μm
In case of hand soldering, the temperature of the soldering
iron should not be above 250°C. Special care must be taken
to avoid touching the capacitor body with the iron tip.
C
B
PAD DIMENSIONS: millimeters (inches)
Size Code
Case Size
A
B
C
01
02
03
1206
1210
1812
1.30
2.00
3.00
(0.051)
(0.079)
(0.118)
1.30
1.30
1.50
(0.051)
(0.051)
(0.059)
2.20 (0.087)
2.20 (0.087)
3.50 (0.137)
A
04
05
16
17
18
2220
2824
4030
5040
6054
5.00
6.00
7.50
11.2
14.6
(0.195)
(0.234)
(0.295)
(0.441)
(0.575)
1.90
2.50
3.00
3.50
3.60
(0.075)
(0.098)
(0.118)
(0.137)
(0.147)
4.50 (0.178)
5.70 (0.224)
8.00 (0.315)
10.3 (0.406)
12.6 (0.496)
RECOMMENDED CLEANING
To clean flux from the PC board assembly, the recommended
products are: ethanol, isopropyl alcohol, and deionized water
wash. The cleaning products to avoid are: Toluene, Xylene,
Trichloroethylene, Terpene Cleaner EC-7, surface active
agent. In case of using another solvent, please contact us.
OTHER CAUTIONS
Flame retardancy: the dielectric film is not a flame retardant
material.
Environment: contact us when chips are used in humid or
gas atmosphere and /or when using resin.
Recommended handling: do not use edged tools, so not
to damage the capacitors.
TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121
Stress Type
Temperature cycling
Ambient Temperature /
Humidity Storage
High Temperature /
Humidity Storage
Ref. Spec.
JESD22-A104
Test Conditions
-55°C +85(+10/-0)°C air
5 to 10 minutes soak 3 cycles/hour
30+/-2°C - 60+/-3% RH -2000H
70+/-5°C - 93+3/-2% RH -1000H
Analysis
SEM x 1000
SEM x 1000
SEM x 1000
Results
Pass
Pass
Pass
34
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