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| 型号： | CBC012-BDC-WP |
| 厂商： | Cymbet Corporation |
| 文件页数： | 3/5页 |
| 文件大小： | 0K |
| 描述： | IC BATT SOLID ST ENERCHIP DIE |
| 产品培训模块： | Energy Processing and Solid State Batteries for Energy Harvesting |
| 标准包装： | 160 |
| 系列： | EnerChip™ |
| 电池化学： | 薄膜 |
| 电压 - 额定： | 3.8V |
| 容量： | 12µAh |
| 尺寸/尺寸： | 0.14" L x 0.11" W（3.5mm x 2.8mm） |
| 端接类型： | SMD（SMT）接片 |
| 放电速率： | 50µA |
| 封装/外壳： | 模具 |
| 包装： | 托盘 - 晶粒 |
| 工作温度： | -20°C ~ 70°C |
| 其它名称： | Q6168697 |
EnerChip? CBC012 Solid State Energy Storage
Package Dimensions - 6-pin DFN (package code D5)
Pin Number(s)
1
2,3,4,5
6
Description
V-
NIC
V+
Notes:
1. All linear dimensions are in millimeters.
2. Drawing is subject to change without notice.
Note: NIC = No Internal Connection
Printed Circuit Board (PCB) Layout Guidelines and Recommendations
Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup
energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering
power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the
board following soldering.
The PCB layout can make this problem worse if the cell’s positive and negative terminals are routed near each
other and under the package, where it is difficult to wash the flux residue away. An undesirable example is
shown in Figure 1. The negative connection on the EnerChip is routed from the negative pad to a via placed
under the package near the positive pad. In this scenario, solder flux residue can wick from the positive solder
pad, covering both the positive pad and the via. This results in a high resistance current path between the
EnerChip terminals. This current path will make the cell appear to be defective or make the application circuit
appear to be drawing too much current.
To avoid this situation, make sure positive and negative traces are routed outside of the package footprint,
as shown in Figure 2, to ensure that flux residue will not cause a discharge path between the positive and
negative pads.
Similarly, a leakage current path can exist from the package lead solder pads to the exposed die pad on the
underside of the package as well as any solder pad on the PCB that would be connected to that exposed die
pad during the reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a
solder pad in the region where the exposed die pad of the package will land. It is sufficient to place PCB solder
pads only where the package leads will be. That region of the PCB where the exposed die pad will land must
not have any solder pads, traces, or vias.
DS-72-02 Rev A
?2009-2010Cymbet Corporation ? Tel: +1-763-633-1780 ? www.cymbet.com
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相关代理商/技术参数 |
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|---|---|
| CBC012-BUC-WP | 制造商:CYMBET 制造商全称:CYMBET 功能描述:Rechargeable Solid State Energy Storage: 12uAh, 3.8V |
| CBC012-D5C | 功能描述:电子电池 12uAhr EnerChip 5x5 DFN C Temp RoHS:否 制造商:Cymbet 电池大小:9 mm x 9 mm 输出电压:3.3 V 容量:50 uAh 化学性质: 端接类型:SMD/SMT 可再充电/不可再充电:Rechargeable |
| CBC012-D5C-TR | 制造商:CYMBET 制造商全称:CYMBET 功能描述:Rechargeable Solid State Energy Storage: 12uAh, 3.8V |
| CBC012-D5C-TR1 | 功能描述:电子电池 12uAhr EnerChip 5x5 DFN-20-70C TR1K RoHS:否 制造商:Cymbet 电池大小:9 mm x 9 mm 输出电压:3.3 V 容量:50 uAh 化学性质: 端接类型:SMD/SMT 可再充电/不可再充电:Rechargeable |
| CBC012-D5C-TR5 | 功能描述:电子电池 12uAhr EnerChip 5x5 DFN-20-70C TR 5K RoHS:否 制造商:Cymbet 电池大小:9 mm x 9 mm 输出电压:3.3 V 容量:50 uAh 化学性质: 端接类型:SMD/SMT 可再充电/不可再充电:Rechargeable |
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