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参数资料
| 型号： | CBC2016T330K |
| 厂商： | Taiyo Yuden |
| 文件页数： | 12/13页 |
| 文件大小： | 0K |
| 描述： | INDUCTOR 33UH 10% 0806 SMD |
| 标准包装： | 1 |
| 系列： | CB |
| 电感： | 33µH |
| 电流： | 220mA |
| 电流 - 饱和： | 220mA |
| 电流 - 温升： | 220mA |
| 容差： | ±10% |
| 屏蔽： | 无屏蔽 |
| DC 电阻(DCR)： | 最大 3.64 欧姆 |
| 频率 - 自谐振： | 14MHz |
| 封装/外壳： | 0806（2016 公制） |
| 安装类型： | 表面贴装 |
| 包装： | 标准包装 |
| 工作温度： | -40°C ~ 105°C |
| 频率 - 测试： | 2.52MHz |
| 其它名称： | 587-3049-6 |
WIRE-WOUND CHIP INDUCTORS (LB SERIES)，
WIRE-WOUND CHIP POWER INDUCTORS (CB SERIES)，
WIRE-WOUND CHIP INDUCTORS FOR SIGNAL LINES (LB SERIES M TYPE)
■ PRECAUTIONS
1．Circuit Design
◆Operating environment
1. The products described in this specification are intended for use in general electronic equipment, (office supply equipment,
Precautions
telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical
equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear
control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or
damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2．PCB Design
Precautions
Technical
considerations
◆Land pattern design
1. Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.
PRECAUTIONS
【Recommended Land Patterns】
Surface Mounting
? Mounting and soldering conditions should be checked beforehand.
? Applicable soldering process to those products is reflow soldering only.
3．Considerations for automatic placement
◆Adjustment of mounting machine
Precautions
Technical
considerations
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4．Soldering
◆Reflow soldering（ LB and CB Types）
1. For reflow soldering with either leaded or lead-free solder, the profile specified in "point for controlling" is recommended.
Precautions
◆Recommended conditions for using a soldering iron
1. Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350℃ Duration-3 seconds or less. The soldering iron
should not come in contact with inductor directly.
◆Reflow soldering（ LB and CB Types）
1. Reflow profile
Technical
considerations
◆Recommended conditions for using a soldering iron
1. Components can be damaged by excessive heat where soldering conditions exceed the specified range.
5．Cleaning
Precautions
Technical
considerations
◆Cleaning conditions
Washing by supersonic waves shall be avoided.
◆Cleaning conditions
If washed by supersonic waves, the products might be broken.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_wound_CB_LB_prec_e-E02R01
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CBC2016T330M | 功能描述:固定电感器 INDCTR HI CUR WND 0806 33uH 20% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| CBC2016T3R3M | 功能描述:固定电感器 INDCTR HI CUR WND 0806 3.3uH 20% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
| CBC2016T3R3M-K | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:Surface Mount Ferrite Products |
| CBC2016T470 | 制造商:TAIYO-YUDEN 制造商全称:Taiyo Yuden (U.S.A.), Inc 功能描述:WOUND CHIP INDUCTORS |
| CBC2016T470K | 功能描述:固定电感器 INDCTR HI CUR WND 0806 47uH 10% RoHS:否 制造商:AVX 电感:10 uH 容差:20 % 最大直流电流:1 A 最大直流电阻:0.075 Ohms 工作温度范围:- 40 C to + 85 C 自谐振频率:38 MHz Q 最小值:40 尺寸:4.45 mm W x 6.6 mm L x 2.92 mm H 屏蔽:Shielded 端接类型:SMD/SMT 封装 / 箱体:6.6 mm x 4.45 mm |
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