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| 型号： | CBT3244ADS |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 开关 |
| 英文描述： | Octal bus switch with quad output enables |
| 中文描述： | 带四输出使能的8个总线开关 |
| 封装： | CBT3244ABQ<SOT764-1 (DHVQFN20)|<<http://www.nxp.com/packages/SOT764-1.html<1<Always Pb-free,;CBT3244AD<SOT163-1 (SO20)|<<http://www.nxp.com/packages/SOT163-1.html<1< |
| 文件页数： | 8/18页 |
| 文件大小： | 109K |
| 代理商： | CBT3244ADS |
9397 750 13362
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 15 September 2005
16 of 18
Philips Semiconductors
CBT3244A
Octal bus switch with quad output enables
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
15. Revision history
Table 10:
Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
Table 11:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
CBT3244_2
20050915
Product data sheet
-
9397 750 13362
CBT3244A_1
Modications:
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
added DHVQFN20 package option (affects Section 2 “Features”, Section 3 “Ordering
Section 2 “Features” on page 1, 6th bullet: changed from ‘exceeds 1000 V HBM ...’ to ‘exceeds
2000 V HBM ...’
CBT3244A_1
20040526
Product data sheet
-
9397 750 13281
-
相关PDF资料 |
PDF描述 |
|---|---|
| CBT3245ADS | Octal bus switch |
| CBT3245APW | Octal bus switch |
| CBT3245ADB | Octal bus switch |
| CBT3245ABQ | Octal bus switch |
| CBT3245AD | Octal bus switch |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CBT3244ADS,112 | 功能描述:数字总线开关 IC OCTAL BUS SWITCH RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| CBT3244ADS,118 | 功能描述:数字总线开关 IC OCTAL BUS SWITCH RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| CBT3244ADS-T | 功能描述:数字总线开关 IC OCTAL BUS SWITCH 10BIT OUTPUT RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| CBT3244AD-T | 功能描述:数字总线开关 IC OCTAL BUS SWITCH 10BIT OUTPUT RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
| CBT3244APW | 功能描述:数字总线开关 IC OCTAL BUS SWITCH 10BIT OUTPUT RoHS:否 制造商:Texas Instruments 开关数量:24 传播延迟时间:0.25 ns 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:TSSOP-56 封装:Reel |
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