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参数资料
| 型号： | CBT3251DS |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 编、解码器及复用、解复用 |
| 英文描述： | 1-of-8 FET multiplexer-demultiplexer |
| 中文描述： | 八选一场效应管复用器/解复用器 |
| 封装： | CBT3251D<SOT109-1 (SO16)|<<http://www.nxp.com/packages/SOT109-1.html<1<week 50, 2005,;CBT3251D<SOT109-1 (SO16)|<<http://www.nxp.com/packages/SOT109-1.html<1<week 50 |
| 文件页数： | 5/16页 |
| 文件大小： | 95K |
| 代理商： | CBT3251DS |
CBT3251_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 21 December 2005
13 of 16
Philips Semiconductors
CBT3251
1-of-8 FET multiplexer/demultiplexer
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°C
or 265
°C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated ux will eliminate the need for removal of corrosive residues in most
applications.
13.4 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the at part of the lead. Contact time must be
limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°C and 320 °C.
13.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales ofce.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
[3]
These transparent plastic packages are extremely sensitive to reow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reow soldering with
peak temperature exceeding 217
°C ± 10 °C measured in the atmosphere of the reow oven. The package
body peak temperature must be kept as low as possible.
Table 9:
Suitability of surface mount IC packages for wave and reow soldering methods
Package [1]
Soldering method
Wave
Reow [2]
BGA, HTSSON..T [3], LBGA, LFBGA, SQFP,
SSOP..T [3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable [4]
suitable
PLCC [5], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended [5] [6]
suitable
SSOP, TSSOP, VSO, VSSOP
not recommended [7]
suitable
CWQCCN..L [8], PMFP [9], WQCCN..L [8]
not suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CBT3251DS,112 | 功能描述:编码器、解码器、复用器和解复用器 1OF8 FET MULTIPLXR/ RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3251DS,118 | 功能描述:编码器、解码器、复用器和解复用器 1OF8 FET MULTIPLXR/ RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3251DS-T | 功能描述:编码器、解码器、复用器和解复用器 1OF8 FET MULTIPLXR/ DEMUX RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3251D-T | 功能描述:编码器、解码器、复用器和解复用器 1OF8 FET MULTIPLXR/ DEMUX RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3251PW | 功能描述:编码器、解码器、复用器和解复用器 1OF8 FET MULTIPLXR/ DEMUX RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
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