- 您现在的位置：买卖IC网 > PDF目录67391 > CBT3251PW (NXP Semiconductors N.V.) 1-of-8 FET multiplexer-demultiplexer PDF资料下载
参数资料
| 型号： | CBT3251PW |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 编、解码器及复用、解复用 |
| 英文描述： | 1-of-8 FET multiplexer-demultiplexer |
| 中文描述： | 八选一场效应管复用器/解复用器 |
| 封装： | CBT3251D<SOT109-1 (SO16)|<<http://www.nxp.com/packages/SOT109-1.html<1<week 50, 2005,;CBT3251D<SOT109-1 (SO16)|<<http://www.nxp.com/packages/SOT109-1.html<1<week 50 |
| 文件页数： | 6/16页 |
| 文件大小： | 95K |
| 代理商： | CBT3251PW |
CBT3251_1
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 21 December 2005
14 of 16
Philips Semiconductors
CBT3251
1-of-8 FET multiplexer/demultiplexer
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ex foil. However, the image sensor package can be mounted by the client on a ex foil by
using a hot bar soldering process. The appropriate soldering prole can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
15. Revision history
Table 10:
Abbreviations
Acronym
Description
CDM
Charged Device Model
ESD
ElectroStatic Discharge
FET
Field-Effect Transistor
HBM
Human Body Model
MM
Machine Model
PRR
Pulse Repetition Rate
TTL
Transistor-Transistor Logic
Table 11:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
CBT3251_1
20051221
Product data sheet
-
相关PDF资料 |
PDF描述 |
|---|---|
| CBT3253APW | Dual 1-of-4 FET multiplexer-demultiplexer |
| CBT3253AD | Dual 1-of-4 FET multiplexer-demultiplexer |
| CBT3253ADB | Dual 1-of-4 FET multiplexer-demultiplexer |
| CBT3253ADS | Dual 1-of-4 FET multiplexer-demultiplexer |
| CBT3257AD | Quad 1-of-2 multiplexer-demultiplexer |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CBT3251PW,112 | 功能描述:编码器、解码器、复用器和解复用器 1OF8 FET MULTIPLXR/ RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3251PW,118 | 功能描述:编码器、解码器、复用器和解复用器 1OF8 FET MULTIPLXR/ RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3251PW118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| CBT3251PW-T | 功能描述:编码器、解码器、复用器和解复用器 1OF8 FET MULTIPLXR/ DEMUX RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3253 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Dual 1-of-4 FET multiplexer/demultiplexer |
发布紧急采购，3分钟左右您将得到回复。