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| 型号： | CBT3253ADB |
| 厂商： | NXP Semiconductors N.V. |
| 元件分类： | 开关 |
| 英文描述： | Dual 1-of-4 FET multiplexer-demultiplexer |
| 中文描述： | 双四选一场效应管复用器/解复用器 |
| 封装： | CBT3253AD<SOT109-1 (SO16)|<<http://www.nxp.com/packages/SOT109-1.html<1<Always Pb-free,;CBT3253AD<SOT109-1 (SO16)|<<http://www.nxp.com/packages/SOT109-1.html<1<Alwa |
| 文件页数： | 5/17页 |
| 文件大小： | 103K |
| 代理商： | CBT3253ADB |
CBT3253A_2
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 — 8 February 2007
13 of 17
NXP Semiconductors
CBT3253A
Dual 1-of-4 FET multiplexer/demultiplexer
13.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 13.
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 10.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CBT3253ADB,112 | 功能描述:编码器、解码器、复用器和解复用器 DUAL1OF4 FET RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3253ADB,118 | 功能描述:编码器、解码器、复用器和解复用器 DUAL1OF4 FET RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3253ADB-T | 功能描述:编码器、解码器、复用器和解复用器 DUAL1OF4 FET MULTIPLEXER/DEMUX RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3253ADS | 功能描述:编码器、解码器、复用器和解复用器 DUAL1OF4 FET MULTIPLEXER/DEMUX RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| CBT3253ADS,112 | 功能描述:编码器、解码器、复用器和解复用器 DUAL1OF4 FET RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
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