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| 型号： | CBTL02043ABQ |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 编、解码器及复用、解复用 |
| 英文描述： | 3.3 V, 2 differential channel, 2 : 1 multiplexer-demultiplexer switch for PCI Express Gen3 |
| 中文描述： | MULTIPLEXER AND DEMUX/DECODER, PQCC20 |
| 封装： | 2.50 X 4.50 MM, 0.85 MM PITCH, PLASTIC, DHVQFN-20 |
| 文件页数： | 4/16页 |
| 文件大小： | 202K |
| 代理商： | CBTL02043ABQ |
CBTL02043A_CBTL02043B
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 1 — 10 March 2011
12 of 16
NXP Semiconductors
CBTL02043A; CBTL02043B
3.3 V, 2 differential channel, 2 : 1 MUX/deMUX switch for PCIe Gen3
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 9) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 9.
Table 9.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 10.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CBTL02043ABQ,115 | 功能描述:多路器开关 IC 3.3V 2 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻（最大值）:7 Ohms 开启时间（最大值）: 关闭时间（最大值）: 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16 |
| CBTL02043B | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3 |
| CBTL02043BBQ | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:3.3 V, 2 differential channel, 2 : 1 multiplexer/demultiplexer switch for PCI Express Gen3 |
| CBTL02043BBQ,115 | 功能描述:多路器开关 IC 3.3V 2 DIFF CH 2:1 MULTI/DEMUX SW RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻（最大值）:7 Ohms 开启时间（最大值）: 关闭时间（最大值）: 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16 |
| CBTL02043BBQ115 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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