参数资料
型号: CD4055BMTG4
厂商: Texas Instruments
文件页数: 8/18页
文件大小: 0K
描述: IC BCD-7SEG DECODER/DRIVR 16SOIC
标准包装: 250
显示器类型: LCD
配置: 7 段显示
接口: BCD
数字或字符: 1 位数字
电流 - 电源: 0.04µA
电源电压: 3 V ~ 18 V
工作温度: -55°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-SOIC(0.154",3.90mm 宽)
供应商设备封装: 16-SOIC N
包装: 带卷 (TR)
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CD4056BMT
ACTIVE
SOIC
D
16
250
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
CD4056BMTE4
ACTIVE
SOIC
D
16
250
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
CD4056BMTG4
ACTIVE
SOIC
D
16
250
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
CD4056BPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
CD4056BPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
CD4056BPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
CD4056BPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
CD4056BPWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
CD4056BPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 3
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