参数资料
| 型号： | CD4071BE |
| 厂商： | Texas Instruments |
| 文件页数： | 28/30页 |
| 文件大小： | 0K |
| 描述： | IC 2-IN OR GATE QUAD 14-DIP |
| 标准包装： | 25 |
| 系列： | 4000B |
| 逻辑类型： | 或门 |
| 电路数： | 4 |
| 输入数： | 2 |
| 电源电压： | 3 V ~ 18 V |
| 电流 - 静态（最大值）： | 1µA |
| 输出电流高，低： | 3.4mA，3.4mA |
| 逻辑电平 - 低： | 1.5 V ~ 4 V |
| 逻辑电平 - 高： | 3.5 V ~ 11 V |
| 额定电压和最大 CL 时的最大传播延迟： | 90ns @ 15V，50pF |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 通孔 |
| 供应商设备封装： | 14-PDIP |
| 封装/外壳： | 14-DIP（0.300"，7.62mm） |
| 包装： | 管件 |
| 产品目录页面： | 922 (CN2011-ZH PDF) |
| 其它名称： | 296-2062-5 CD4071BE-ND |
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Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
CD4075BMTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BMTG4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BNSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BNSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BNSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BPWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BPWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4075BPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
JM38510/17101BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
JM38510/17103BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
Addendum-Page 3
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CD4071BE | 制造商:Texas Instruments 功能描述:IC 4000 CMOS 4071 DIP14 18V |
| CD4071BEE4 | 功能描述:逻辑门 Quad 2-Input RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量（输入/输出）:2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel |
| CD4071BEG4 | 功能描述:IC GATE OR 4CH 2-INP 14-DIP 制造商:texas instruments 系列:4000B 包装:管件 零件状态:在售 逻辑类型:或门 电路数:4 输入数:2 特性:- 电压 - 电源:3 V ~ 18 V 电流 - 静态（最大值）:1μA 电流 - 输出高，低:3.4mA，3.4mA 逻辑电平 - 低:1.5 V ~ 4 V 逻辑电平 - 高:3.5 V ~ 11 V 不同 V，最大 CL 时的最大传播延迟:90ns @ 15V，50pF 工作温度:-55°C ~ 125°C 安装类型:通孔 供应商器件封装:14-PDIP 封装/外壳:14-DIP（0.300"，7.62mm） 基本零件编号:4071 标准包装:25 |
| CD4071BES2515 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| CD4071BF | 制造商:Texas Instruments 功能描述:OR Gate 4-Element 2-IN CMOS 14-Pin CDIP Tube 制造商:Texas Instruments 功能描述:OR GATE 4-ELEM 2-IN CMOS 14CDIP - Rail/Tube |
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