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参数资料
| 型号： | CDR05BX101BDWM |
| 厂商： | KEMET Corporation |
| 元件分类： | 电容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件页数： | 1/10页 |
| 文件大小： | 949K |
| 代理商： | CDR05BX101BDWM |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET
SIZE
CODE
C0805
C1805
C1808
C1812
T
STYLE
CDR01
CDR02
CDR03
CDR04
L
W
MIN.
MAX.
BW
2.03 ±.38 (.080 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
4.57 ±.38 (.180 ±.015)
+.51
4.57
–
.38
5.72 ±.51 (.225 ±.020)
2.00 ±.20 (.078 ±.008)
3.20 ±.20 (.125 ±.008)
3.20 ±.25 (.125 ±.010)
4.50 ±.25 (.176 ±.010)
4.50 ±.30 (.176 ±.012)
1.27 ±.38 (.050 ±.015)
1.27 ±.38 (.050 ±.015)
2.03 ±.38 (.080 ±.015)
3.18 ±.38 (.125 ±.015)
+.51
6.35
–
.38
6.35 ±.51 (.250 ±.020)
1.25 ±.20 (.049 ±.008)
1.60 ±.20 (.062 ±.008)
2.50 ±.25 (.098 ±.010)
3.20 ±.25 (.125 ±.010)
6.40 ±.30 (.250 ±.012)
.56 (.022)
.56 (.022)
.56 (.022)
.56 (.022)
1.40 (.055)
1.40 (.055)
2.03 (.080)
2.03 (.080)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
.51 ± 0.25 (.020 ±.010)
+.020
.180
–
.015
+.020
.250
–
.015
CDR05
C1825
.51 (.020)
2.03 (.080)
.51 ± 0.25 (.020 ±.010)
CDR06
CDR31
CDR32
CDR33
CDR34
CDR35
C2225
C0805
C1206
C1210
C1812
C1825
.51 (.020)
2.03 (.080)
1.30 (.051)
1.30 (.051)
1.50 (.059)
1.50 (.059)
1.50 (.059)
.51 ± 0.25 (.020 ±.010)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.20 (.020 ±.008)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.25 (.020 ±.010)
.50 ± 0.30 (.020 ±.012)
)
CERAMIC CHIP/MIL-PRF-55681
CERAMIC
SIZE CODE
See Table Above
SPECIFICATION
P-MIL-PRF-55681 = CDR01-CDR06
N-MIL-PRF-55681 = CDR31-CDR35
CAPACITANCE CODE
Expressed in picofarads (pF).
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 thru 9.9 pF. Example: 2.2 pF
–
229)
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±
.1 pF
±
.25 pF
±
.5 pF
±
1%
±
5%
±
10%
±
20%
FAILURE RATE LEVEL
(%/1000 hrs.)
M
P
—
0.1
S
—
0.001
TERMINATION FINISH
S
(SolderGuard I)
U
—
Base Metalization
—
Barrier Metal
—
Solder
Coated (SolderGuard I)
W
—
Base Metalization
—
Barrier Metal
—
Tinned
Tin or (Tin/Lead Alloy)
SolderGuard II
Y
—
Base Metalization
Barrier Metal
—
Tinned
(100% Tin) Solderguard II
CAPACITANCE TOLERANCE
B
C
D
F
J
K
M
±.1 pF ±.25 pF ±.5 pF
±1%
±5%
±10%
±20%
RATED VOLTAGE
A
—
50; B
—
100
END METALIZATION
C
—
SolderGuard II
(100% Sn)
(Military equiv: Y, W)
H
—
SolderGuard I
(Sn60)
(Military equiv: S, U)
FAILURE RATE
(%/1,000 hrs.)
M
—
1.0
R
—
0.01
P
—
0.1
S
—
0.001
VOLTAGE TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G
—
BP (C0G/NP0) (±30 PPM/
°
C)
X
—
BX (±15% Without Voltage
+15% -25% With Voltage)
VOLTAGE
1
—
100V, 5
—
50V
MIL-PRF-55681 PART NUMBER ORDERING INFORMATION
CDR01
B
P
101
CAPACITOR OUTLINE DRAWINGS
DIMENSIONS—MILLIMETERS AND (INCHES)
Note: For Solderguard I (MIL-C55681
“
S
”
or
“
U
”
Endmets), the length, width and thickness positive tolerances (including bandwidth) cited above are allowed to increase by the following
amounts:
Length
Width/Thickness
0.38MM (.015)
0.38MM (.015)
0.30MM (.012)
CDR01
CDR02-06
CDR31-35
0.51MM (.020)
0.64MM (.025)
0.60MM (.023)
(
)
B K
S M
STYLE & SIZE CODE
C
—
Ceramic
D
—
Dielectric, Fixed Chip
R
—
Established Reliability
RATED TEMPERATURE
–
DIELECTRICS
P
C
—
WITH OR WITHOUT VOLTAGE
X
—
± 15%
—
without voltage
+ 15%,
–
25%
—
with voltage
Expressed in picofarads (pF).
First 2 digits represent significant figures and the last digit specifies the number of zeros to follow.
(Use 9 for 1.0 through 9.9pF. Example: 2.2pF = 229)
KEMET/MIL-PRF-55681 PART NUMBER EQUIVALENTS
C 0805
P
101
K
1
G
M
C*
CHIP DIMENSIONS
BW
W
L
T
“SOLDERGUARD I” *
SOLDER
NICKEL
SILVER
METALLIZATION
ELECTRODES
“SOLDERGUARD II”
TINNED
NICKEL
SILVER
METALLIZATION
ELECTRODES
Military Designation - “S” or “U”
KEMET Designation - “H”
Military Designation - “W” or “Y”
KEMET Designation - “C”
* Part Number Example: C0805P101K1GMC
(14 digits - no spaces)
8
7
C
相关PDF资料 |
PDF描述 |
|---|---|
| CDR05BX101BDWP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR05BX101BDWR | CERAMIC CHIP/MIL-PRF-55681 |
| CDR05BX109ABSM | CERAMIC CHIP/MIL-PRF-55681 |
| CDR05BX109ABSP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR05BX109ABSR | CERAMIC CHIP/MIL-PRF-55681 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CDR05BX104BKSR | 制造商:KYOCERA ELCO Corporation 功能描述:Cap Ceramic 0.1uF 100V X7R 10% SMD 1825 (0.01%FR) 125 制造商:AVX Corporation 功能描述:CAP 0.1UF 100VDC X7R 10% SMD 1825 0.01% - Bulk 制造商:AVX Corporation 功能描述:military capacitor |
| CDR05BX104BKSR\\1 | 制造商:AVX Corporation 功能描述:SMP MLC HI-REL - Custom Tape W/Leader |
| CDR05BX104BKSR\\6 | 制造商:AVX Corporation 功能描述:SMP MLC HI-REL - Gel-pak, waffle pack, wafer, diced wafer on film |
| CDR05BX104BKSR\\M | 制造商:AVX Corporation 功能描述:CAP 0.1UF 100VDC X7R 10% SMD 1825 0.01% - Custom Tape W/Leader |
| CDR05BX104BKSR\1 | 制造商:AVX Corporation 功能描述:SMP MLC HI-REL - Tape and Reel |
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