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参数资料
| 型号： | CDR13BP221CFMS |
| 厂商： | AVX Corporation [MIL] |
| 文件页数： | 1/9页 |
| 文件大小： | 0K |
| 描述： | CAP CER 220PF 200V 1% BP 1111 |
| 标准包装： | 1 |
| 系列： | 军用, MIL-PRF-55681, CDR13 |
| 电容： | 220pF |
| 电压 - 额定： | 200V |
| 容差： | ±1% |
| 温度系数： | BP |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 通用 |
| 封装/外壳： | 1111（2828 公制） |
| 尺寸/尺寸： | 0.110" L x 0.110" W（2.79mm x 2.79mm） |
| 厚度： | 0.102"（2.59mm） |
| 特点： | 军用 |
| 包装： | 标准包装 |
| 故障率： | S（0.001%） |
| 其它名称： | 1010-1023-6 |
Microwave MLC’s
CDR Series — MIL-PRF-55681 (RF/Microwave Chips)
MILITARY DESIGNATION PER MIL-PRF-55681
W
L
A 0J
T
W
10
0J
L
T
47
bw
CDR11/12
bw
CDR13/14
CROSS REFERENCE: AVX/MIL-PRF-55681
Per MIL-C-55681
AVX
Length (L)
Width (W)
Thickness (T)
Termination Band (bw)
Style
Max Min
Max Min
CDR11
CDR12
CDR13
CDR14
AQ11
AQ12
AQ13
AQ14
.055±.015
(1.40±.381)
.055±.025
(1.40±.635)
.110±.020
(2.79±.508)
.110 +.035 -0.020
(2.79 +.889 -.508)
.055±.015
(1.40±.381)
.055±.015
(1.40±.381)
.110±.020
(2.79±.508)
.110±.020
(2.79±.508)
.057
(1.45)
.057
(1.45)
.102
(2.59)
.102
(2.59)
.020
(.508)
.020
(.508)
.030
(.762)
.030
(.762)
.020
(.508)
.020
(.508)
.025
(.635)
.025
(.635)
.005
(.127)
.005
(.127)
.005
(.127)
.005
(.127)
HOW TO ORDER
CDR12
MIL Style
CDR11, CDR12,
CDR13, CDR14
BG
101
Capacitance
EIA Capacitance Code in pF.
First two digits = significant figures
or “R” for decimal place.
Third digit = number of zeros or
after “R” significant figures.
A
K
Capacitance
Tolerance Code
B = ±.1 pF
C = ±.25 pF
D = ±.5 pF
F = ±1%
G = ±2%
J = ±5%
U
Termination
Finish (Military
Designations)
Code
S
Failure Rate
Level
M = 1.0%
P = .1%
R = .01%
S = .001%
Voltage
Temperature
Limits
BG = +90±20 ppm/°C with and without
rated voltage from -55°C to + 125°C
BP = 0±30ppm/°C with and without
rated voltage from -55°C to +125°C
Rated Voltage
Code
A = 50V
B = 100V
C = 200V
D = 300V
E = 500V
K = ±10%
M = ±20%
M = Palladium/Silver (CDR11 & 13 only)
N = Silver, Nickel, Gold (CDR11 & 13 only)
S = Solder Coated, Final (CDR12 & 14 only)
U = Base Metallization, Barrier Metal, Solder
Coated. (Solder M.P. 200°C or less)
(CDR12 & 14 only)
W = Base Metallization, Barrier Metal,
Tinned (Tin or Tin/Lead Alloy)
PACKAGING
(CDR12 & 14 only)
Y = 100% Tin
9
Standard Packaging Quanity
CDR11-12 = 100 pcs per waffle pack
CDR13-14 = 80 pcs per waffle pack
(CDR12 & 14 only)
Z = Base Metallization, Barrier Metal
(TIn Lead Alloy With 4% Lead Min.)
(CDR12 & 14 only)
Not RoHS Compliant
TAPE & REEL: All tape and reel specifications are in compliance with EIA RS481
(equivalent to IEC 286 part 3).
Sizes SQCA through SQCB, CDR11/12 through 13/14.
—8mm carrier
—7" reel: ≤0.040" thickness = 2000 pcs
≤0.075" thickness = 2000 pcs
—13" reel: ≤0.075" thickness = 10,000 pcs
160
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CDR13BP221CFMS\\M500 | 制造商:AVX Corporation 功能描述:CAP CER 220PF 200V 1% BP 1111 |
| CDR13BP221CFMS\M250 | 制造商:AVX Corporation 功能描述:CAP 220PF 200VDC C0G 1% SMD 0.001% - Tape and Reel |
| CDR13BP221CFMS\M500 | 制造商:AVX Corporation 功能描述:CAP 220PF 200VDC C0G 1% SMD 0.001% - Tape and Reel 制造商:AVX Corporation 功能描述:CAP CER 220PF 200V 1% BP 1111 |
| CDR13BP241CFMP | 制造商:AVX Corporation 功能描述:CAP 240PF 200VDC C0G 1% SMD 0.1% - Waffle Pack |
| CDR13BP241CFMR | 制造商:AVX Corporation 功能描述:CAP 240PF 200VDC C0G 1% SMD 0.01% - Waffle Pack |
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