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参数资料
| 型号： | CDR32BX109BBSM |
| 厂商： | KEMET Corporation |
| 元件分类： | 电容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件页数： | 7/10页 |
| 文件大小： | 949K |
| 代理商： | CDR32BX109BBSM |
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
8mm ±.30
(.315 ±.012")
or
12mm ±.30
(.472 ±.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
Embossment
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
* Punched paper carrier used for 0402 and 0603 case size.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
KEMET
X
C
G
Z
Y
Grid
placement
courtyard
Z
2.14
2.78
3.30
4.50
5.90
7.00
G
0.28
0.68
0.70
1.50
2.30
3.30
X
0.74
1.08
1.60
2.00
2.90
3.70
6.90
5.50
6.80
Y(ref)
0.93
1.05
1.30
1.50
1.80
1.85
C(ref)
1.21
1.73
2.00
3.00
4.10
5.15
Z
3.18
3.70
4.90
G
0.68
0.70
1.50
X
0.80
1.10
1.40
2.00
Y(ref)
1.25
1.50
1.70
Smin
1.93
2.20
3.20
Wave Solder
Reflow Solder
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
0402
0603
0805
1206
1210
1812
1825
2220
2225
Dimension
Not Recommended
C
X
Grid
Placement
Courtyard
G
Y
Z
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
93
Packaging
相关PDF资料 |
PDF描述 |
|---|---|
| CDR32BX109BBSP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSR | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBUM | CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBUP | CERAMIC CHIP/MIL-PRF-55681 |
| CDR63BNP-390LC | 1 ELEMENT, 39 uH, GENERAL PURPOSE INDUCTOR, SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CDR32BX109BBSP | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBSR | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBUM | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBUP | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
| CDR32BX109BBUR | 制造商:KEMET 制造商全称:Kemet Corporation 功能描述:CERAMIC CHIP/MIL-PRF-55681 |
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