参数资料
| 型号： | CG0402MLA-5.5MG |
| 厂商： | Bourns Inc. |
| 文件页数： | 3/4页 |
| 文件大小： | 0K |
| 描述： | CHIP GUARD |
| 标准包装： | 10,000 |
| 系列： | ChipGuard® |
| 变阻器电压： | 8V |
| 电流 - 浪涌： | 20A |
| 电路数： | 1 |
| 最大交流电压： | 4VAC |
| 最大直流电压： | 5.5VDC |
| 能量： | 0.05J |
| 封装/外壳： | 0402（1005 公制） |
ChipGuard ? MLA Series Varistor ESD Clamp Protectors
Product Dimensions
A
Recommended Pad Layout
A
L
W
B
DIMENSIONS:
MM
(INCHES)
C
D
B
CG0402MLA
CG0603MLA
CG0402MLA
CG0603MLA
Dimension
L
W
A
B
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.50 ± 0.10
(0.02 ± 0.004)
0.25 ± 0.15
(0.10 ± 0.006)
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
A
B
C
D
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Re?ow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
250
A
Stage 1 Preheat
Ambient to Preheating
Temperature
30 s to 60 s
200
150
100
50
0
110 sec. (min.)
30-70
120 sec. (min.)
B
C
D
E
Stage 2 Preheat
Stage 3 Preheat
Main Heating
Cooling
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
200 °C to 100 °C
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
1 °C/s to 4 °C/s
sec.
Time (seconds)
?
?
?
?
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications.
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| FHP-08-02-T-S | CONN RCPT .156" 8POS TIN SMD |
| CG0402MLA-14KG | CHIP GUARD |
| 9-103325-0-01 | CONN HEADR BRKWAY .100 01POS R/A |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CG0402MLC | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:ChipGuard MLC Series - ESD Protectors Memory protection HDMI 1.4 |
| CG0402MLC-05LEA | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:ChipGuard MLC Series - ESD Protectors Memory protection HDMI 1.4 |
| CG0402MLC-05LG | 功能描述:ESD 抑制器 CHIP GUARD 5VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| CG0402MLC-05LGA | 功能描述:ESD 抑制器 CHIP GUARD 5VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| CG0402MLC-12LG | 功能描述:ESD 抑制器 CHIP GUARD 12VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
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