参数资料
| 型号： | CG0402MLC-12LG |
| 厂商： | Bourns Inc. |
| 文件页数： | 2/3页 |
| 文件大小： | 0K |
| 描述： | SUPPRESSOR ESD 12VDC 0402 SMD |
| 产品培训模块： | ESD Protection Products |
| 产品目录绘图： | CG0402(MLC,MLU) Series Side CG0402(MLC,MLU) Series Top |
| 标准包装： | 1 |
| 系列： | ChipGuard® |
| 电路数： | 1 |
| 最大直流电压： | 12VDC |
| 封装/外壳： | 0402（1005 公制） |
| 产品目录页面： | 2408 (CN2011-ZH PDF) |
| 其它名称： | CG0402MLC-12LGDKR |
ChipGuard ? MLC Series - ESD Protectors
Product Dimensions
A
Recommended Pad Layout
A
L
W
B
DIMENSIONS:
MM
(INCHES)
C
D
B
CG0402
CG0603
CG0402
CG0603
Dimension
L
W
A
B
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.36 ± 0.05
(0.014 ± 0.002)
0.25 ± 0.15
(0.10 ± 0.006)
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.45 ± 0.10
(0.018 ± 0.004)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
A
B
C
D
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Re?ow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
250
200
150
100
50
0
A
B
C
D
Stage 1 Preheat
Stage 2 Preheat
Stage 3 Preheat
Main Heating
Ambient to Preheating
Temperature
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
250 °C to 255 °C
30 s to 60 s
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
5s
110 sec. (min.)
30-70
120 sec. (min.)
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
sec.
Time (seconds)
?
?
?
?
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
相关PDF资料 |
PDF描述 |
|---|---|
| 44764-1002 | CONN HEADER 10POS 3MM R/A GOLD |
| CG0603MLC-05LE | SUPPRESSOR ESD 5VDC 0603 SMD |
| ISL55290IUZ | IC OPAMP LP DUAL ULT LN 10-MSOP |
| TMF12-221-0.3 | CIRCUIT BRKR THERMAL 300MA 1POLE |
| TMF12-221-5 | CIRCUIT BRKR THERMAL 5A 1POLE |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CG0402MLC-12LGA | 功能描述:ESD 抑制器 CHIP GUARD 12VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| CG0402MLC-24LG | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:ChipGuard MLC Series - ESD Protectors |
| CG0402MLC-24LGA | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:ChipGuard MLC Series - ESD Protectors |
| CG0402MLC-3.3LG | 功能描述:ESD 抑制器 CHIP GUARD 3.3VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| CG0402MLC-3.3LGA | 功能描述:ESD 抑制器 CHIP GUARD 3.3VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
发布紧急采购，3分钟左右您将得到回复。