参数资料
| 型号： | CG0402MLE-18G |
| 厂商： | Bourns Inc. |
| 文件页数： | 2/3页 |
| 文件大小： | 0K |
| 描述： | CHIP GUARD |
| 标准包装： | 10,000 |
| 系列： | ChipGuard® |
| 电路数： | 1 |
| 最大交流电压： | 8.5VAC |
| 最大直流电压： | 18VDC |
| 封装/外壳： | 0402（1005 公制） |
3312 - 2 ? SMD Varistor ESD Clamp
ChipGuard mm MLE Series Trimming Potentiometer Protectors
Product Dimensions
A
Recommended Pad Layout
A
L
W
B
DIMENSIONS:
MM
(INCHES)
C
D
B
CG0402MLE
CG0603MLE
CG0402MLE
CG0603MLE
Dimension
L
W
A
B
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.50 ± 0.10
(0.02 ± 0.004)
0.25 ± 0.15
(0.10 ± 0.006)
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
A
B
C
D
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Re?ow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Stage 1 Preheat
Ambient to Preheating
30 s to 60 s
Temperature
250
200
150
100
50
0
B
C
D
Stage 2 Preheat
Stage 3 Preheat
Main Heating
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
110 sec. (min.)
30-70
120 sec. (min.)
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
sec.
Time (seconds)
?
?
?
?
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
ChipGuard Product Designator
A solder gun under 30 watts is recommended.
How to Order
CG 0n0n MLE - 18 x
?
Package Option
0402 = 0402 Package 0603 = 0603 Package
Multilayer Series Designator
Operating Voltage
18 = 18 V
Tape & Reel Packaging
E = 4,000 pcs. per reel (0603 package) G = 10,000 pcs. per reel (0402 package)
Ni barrier terminations are standard on all ChipGuard ? part numbers.
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CG0402MLU | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:ChipGuard MLU Series - ESD Protectors Memory protection Automotive |
| CG0402MLU-05G | 功能描述:ESD 抑制器 CHIP GUARD 5VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| CG0402MLU-12G | 功能描述:ESD 抑制器 CHIP GUARD 12VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| CG0402MLU-12G_11 | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:Coaxial Port - ESD Protection |
| CG0402MLU-12G_12 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Coaxial Port - ESD Protection |
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