参数资料
| 型号： | CG0402MLU-24G |
| 厂商： | Bourns Inc. |
| 文件页数： | 2/3页 |
| 文件大小： | 0K |
| 描述： | SUPPRESSOR ESD 24VDC 0402 SMD |
| 产品培训模块： | ESD Protection Products |
| 产品目录绘图： | CG0402(MLC,MLU) Series Side CG0402(MLC,MLU) Series Top |
| 标准包装： | 1 |
| 系列： | ChipGuard® |
| 电路数： | 1 |
| 最大直流电压： | 24VDC |
| 封装/外壳： | 0402（1005 公制） |
| 产品目录页面： | 2408 (CN2011-ZH PDF) |
| 其它名称： | CG0402MLU-24GDKR |
ChipGuard ? MLU Series - ESD Protectors
Product Dimensions
A
Recommended Pad Layout
A
W
B
DIMENSIONS:
MM
(INCHES)
L
C
D
B
CG0402
CG0603
CG0402
CG0603
Dimension
L
W
A
B
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.36 ± 0.05
(0.014 ± 0.002)
0.25 ± 0.15
(0.10 ± 0.006)
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.45 ± 0.10
(0.018 ± 0.004)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
A
B
C
D
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Re?ow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
250
A
Stage 1 Preheat
Ambient to Preheating
Temperature
30 s to 60 s
200
150
100
50
0
110 sec. (min.)
30-70
120 sec. (min.)
B
C
D
E
Stage 2 Preheat
Stage 3 Preheat
Main Heating
Cooling
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
200 °C to 100 °C
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
1 °C/s to 4 °C/s
sec.
Time (seconds)
?
?
?
?
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
相关PDF资料 |
PDF描述 |
|---|---|
| CG0603MLA-26KE | CHIP GUARD |
| CG0603MLD-12E | VARISTOR 12VDC 1CH 0603 SMD |
| CG0603MLE-18E | CHIP GUARD |
| CG0805MLA-5.5ME | VARISTOR 12V 4CH 0805 |
| CG1206MLC-12E | VARISTOR 12VDC 4CH 1206 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CG0402MLU-3.3G | 功能描述:ESD 抑制器 CHIP GUARD 3.3VOLT RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
| CG-050-24A | 制造商:SMC Corporation of America 功能描述:Mounting Bracket, Pivot Type, Receiving, for CG Series Air Cylinders w/50mm Bore |
| CG0603 | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:ChipGuard MLU Series - ESD Protectors Memory protection Automotive |
| CG0603MLA14KE | 制造商:BOURNS 功能描述:New |
| CG0603MLA-14KE | 功能描述:ESD 抑制器 CHIP GUARD 14VOLT 10% RoHS:否 制造商:STMicroelectronics 通道:8 Channels 击穿电压:8 V 电容:45 pF 端接类型:SMD/SMT 封装 / 箱体:uQFN-16 功率耗散 Pd: 工作温度范围:- 40 C to + 85 C |
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