参数资料
| 型号： | CG0603MLU-3.3E |
| 厂商： | Bourns Inc. |
| 文件页数： | 2/3页 |
| 文件大小： | 0K |
| 描述： | SUPPRESSOR ESD 3.3VDC 0603 SMD |
| 产品培训模块： | ESD Protection Products |
| 产品目录绘图： | CG0603(MLC,MLU)Series Top CG0603(MLC,MLU)Series Side |
| 标准包装： | 1 |
| 系列： | ChipGuard® |
| 电路数： | 1 |
| 最大直流电压： | 3.3VDC |
| 封装/外壳： | 0603（1608 公制） |
| 产品目录页面： | 2408 (CN2011-ZH PDF) |
| 其它名称： | CG0603MLU-3.3EDKR |
ChipGuard ? MLU Series - ESD Protectors
Product Dimensions
A
Recommended Pad Layout
A
W
B
DIMENSIONS:
MM
(INCHES)
L
C
D
B
CG0402
CG0603
CG0402
CG0603
Dimension
L
W
A
B
Series
1.00 ± 0.15
(0.04 ± 0.006)
0.50 ± 0.10
(0.02 ± 0.004)
0.36 ± 0.05
(0.014 ± 0.002)
0.25 ± 0.15
(0.10 ± 0.006)
Series
1.60 ± 0.20
(0.064 ± 0.008)
0.80 ± 0.20
(0.032 ± 0.008)
0.45 ± 0.10
(0.018 ± 0.004)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
A
B
C
D
Series
0.51
(0.020)
0.61
(0.024)
0.51
(0.020)
1.70
(0.067)
Series
0.76
(0.030)
1.02
(0.040)
0.50
(0.020)
2.54
(0.100)
Solder Re?ow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
250
A
Stage 1 Preheat
Ambient to Preheating
Temperature
30 s to 60 s
200
150
100
50
0
110 sec. (min.)
30-70
120 sec. (min.)
B
C
D
E
Stage 2 Preheat
Stage 3 Preheat
Main Heating
Cooling
140 °C to 160 °C
Preheat to 200 °C
200 °C
210 °C
220 °C
230 °C
240 °C
200 °C to 100 °C
60 s to 120 s
20 s to 40 s
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
1 °C/s to 4 °C/s
sec.
Time (seconds)
?
?
?
?
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Speci?cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their speci?c applications.
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