参数资料
型号: CG1272 DAISY CHAIN
厂商: Microsemi SoC
文件页数: 7/16页
文件大小: 0K
描述: DAISY CHAIN PKG MECH 1272-CCGA
标准包装: 1
附件类型: 菊花链封装
适用于相关产品: Microsemi FPGA
RTSX-SU
Flight-proven in space—time after time
RTSX-SU radiation-tolerant FPGAs are enhanced versions of Microsemi’s commercial SX-A family of devices, specifically designed for enhanced radiation 
performance. Featuring SEU-hardened D-type flip-flops that offer the benefits of triple module redundancy (TMR) without requiring cumbersome user 
intervention, the RTSX-SU family is a unique product offering for space applications.
?  230 MHz system performance 
(310 MHz internal) 
?  Very low power consumption 
(up to 68 μW at standby) 
?  3.3 V and 5.0 V mixed voltage 
?  Configurable I/O support for 
3.3 V / 5 V PCI, LVTTL, TTL
and CMOS
?  Secure programming technology 
protects against reverse
engineering and design theft
?  100% circuit resource utilization 
with 100% pin locking 
?  Unique in-system diagnostic 
and verification capability 
with Silicon Explorer II
?  Low cost prototyping option 
?  Deterministic, user-controllable 
timing
?  JTAG boundary scan testing in 
compliance with IEEE Standard
1149.1—dedicated JTAG 
reset (TRST) pin
?  Highly reliable, nonvolatile 
antifuse technology
?  32,000 to 72,000 ASIC gates 
(48,000 to 108,000 system gates) 
?  Up to 360 user-programmable I/Os 
?  Hermetically-sealed packages 
for space applications (CQFP,
CCGA/CLGA, CCLG)
RTSX- SU Devices
RTSX-SU Devices
Capacity
Typical Gates
System Gates
Logic Modules
Combinatorial Cells
SEU-Hardened Register Cells (D-flip-flops)
Maximum Flip-Flops
Maximum User I/Os
Clocks
Quadrant Clocks
Speed Grades
Package Pins
CQ
CG
CC
I/Os Per Package
RTSX-SU Devices
CQ84
CQ208
CQ256
CC256
CG624
Note:
The user I/Os include clock buffers.
RTSX32SU
32,000
48,000
1,800
1,080
1,980
227
3
0
Std., –1
84, 208, 256
256
RTSX32SU
62
173
227
202
RTSX72SU
72,000
108,000
4,024
2,012
4,024
360
3
4
Std., –1
208, 256
624
RTSX72SU
170
212
360
An up-to-date cross reference list showing DSCC part numbers is posted at www.microsemi.com/soc/documents/DSCC_CrossRef.pdf.
7
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