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参数资料
| 型号： | CHP0230-PM-0000 |
| 厂商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 824 to 849 MHz 28.5 dBm, Cellular InGaP HBT Amplifier Module |
| 中文描述： | 824至849兆赫28.5 dBm的，蜂窝的InGaP HBT功率放大器模组 |
| 文件页数： | 2/4页 |
| 文件大小： | 414K |
| 代理商： | CHP0230-PM-0000 |
3236 Scott Boulevard, Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
CHP0230-PM
Product Specifications - July 2002
(2 of 4)
Parameter
Frequency Range
Gain
Gain Ripple*
Gain Variation
Condition
Min
824
29
Typ
Max
849
33
1.5
Units
MHz
dB
dB
dB/V
dB/°C
dBm
dBm
dBc
dBc
dBm
dBc/30KHz
dBc/30KHz
dBc/30KHz
dBc/30KHz
dB
dB
mA
mA
mA
mA
mA
V
μA
@ Digital power output
824-849 MHz
Over supply voltage
Over temperature
CDMA mode
Analog
2nd @ Po = +31.5 dBm
3rd @ Po = +31.5 dBm
30 kHz bandwidth
CDMA mode @ +28.5 dBm Pout, 885 kHz offset
CDMA mode @ +28.5 dBm Pout, 1.9 MHz offset
CDMA2K 1X mode** @ +27.8 dBm Pout, 885 kHz offset
CDMA2K 1X mode** @ +27.8 dBm Pout, 1.9 MHz offset
30
2
0.03
+28.5
+31.0
-30
-30
-90
-52
-59
-49
-58
4.0
-10
105
515
750
60
2.0
2.95
Power Output
Harmonics
Noise Power in Receive Band
Linearity (ACPR)
-47
-56
-47
-56
5.0
Noise Figure
Input Return Loss
Icc(Vcc= 3.6 V)
Pout = +12.0 dBm - CDMA mode
Pout = +28.5 dBm - CDMA mode
Pout = +31.5 dBm - Analog mode
No RF
112
560
815
Quiescent Current (Iq)
VrefSupply Current (Iref)
VrefSupply Voltage (Vref)
Leakage Current
5.0
Fixed and regulated (1.2% tolerance)
Vref= 0 V, Vcc = 3.6 V
10
Electrical Characteristics
Unless otherwise specified, the following specifications are guaranteed at room temperature with collector voltage (+Vcc) = 3.6 V.
* Specifications guaranteed over the temperature range of -20°C to +70°C. ** Modulation HPSK in 1.2288 MHz, RC3 PAR = 4.7 @ 1% CCDF.
Modulation
When biased as specified, the CHP0230-PM will
achieve the required adjacent channel response for the digital
system specified. Celeritek tests 100% of each product under
digital modulation to ensure correlation to customer applica-
tions.
Thermal
1. The ground pad on the backside of the CHP0230-PM must
be soldered to the ground plane.
2. All leads of the package must be soldered to the appropriate
electrical connection.
– Continued from Page 1 –
TM
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