11
CLD-CT979.004
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
www.cree.com/ledlamps
Copyright 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and
the Cree logo are registered trademarks of Cree, Inc.
Soldering & Handling
1. Cleaning
Don’tuseunspecifiedchemicalliquidstocleantheSMDLED;thechemicalcouldharmtheSMDLED.Whenwashing
is necessary, please immerse the SMD LED in alcohol at normal room temperature for less than 1 minute and dry at
normal room temperature for 15 minutes before use.
TheinfluenceofultrasoniccleaningontheSMDLEDdependingonfactorssuchasultrasonicpowerandtheway
SMDLEDaremounted.Ultrasoniccleaningshallbepre-qualifiedtoensurethiswillnotcausedamagetotheSMD
LED.
2. Moisture Proof Packing
In order to prevent moisture absorption into SMD LED during the transportation and storage, SMD LED is packed
in a moisture barrier bag. Desiccants and a humidity indicator are packed together with SMD LED as the secondary
protection. The indication of humidity indicator card provides the information of humidity within SMD packing.
3. Storage
Shelflifeinoriginalsealedbagatstorageconditionof<40Cand<90%RHis12months.Bakingisrequired
whenever shelf life is expired.
Before openning the packaging , Please check whether bag leak air or not.
Afterbagopening,theSMDLEDmustbestoredunderthecondition<30Cand<60%RH.Underthiscondition,
SMDLEDmustbeused(subjecttoreflow)within168hoursafterbagopening,andre-bakingisrequiredwhen
exceeding 168 hours.
Forbaking,placeSMDLEDinovenattemperature80C±5Candrelativehumidity<=10%RH,for24hours.
Take out the material from packaging bag for re-bake. Do not open the door of oven frequently during the baking
process.
4. Soldering
Manual soldering by soldering iron
The use of a soldering iron of less than 25W is recommended and the temperature of the iron must be kept at
below 315C, with soldering time within 2 seconds.
The epoxy resin of SMD LED should not be in contact with tip of soldering iron.
No mechanical stress should be exerted on the resin portion of SMD LED during soldering.
Handling of SMD LED should be done when the package has been cooled down to below 40C or less. This is to
prevent the SMD LED failures due to thermal-mechanical stress during handling.
ReflowSoldering
Thetemperature(TopsurfaceofSMDLED)profileisasbelow:
Melting-point
Pre-heat
Soak
Reflow
Cooling
Time
T
emperatu
re
Heat Sink
Solder = Lead-free
Average ramp-up rate = 4C/s max
Peak temperature = 250C max.
Preheat temperature = 150C ~200C
Time within 5C of actual Peak Temperature = 10s max.
Preheat time = 100s max.
Duration above 217C is 80s max.
Ramp-down rate = 6C/s max.