参数资料
型号: CM01U161T
厂商: Taiyo Yuden
文件页数: 8/8页
文件大小: 0K
描述: CHOKE COMMON MODE 160 OHMS SMD
产品变化通告: CM01 Series Discontinuation 06/Mar/2012
产品目录绘图: CM01(H,S) Series Top
CM01(H,S) Series Side 2
CM01(H,S) Series Side 2
标准包装: 1
系列: CM01
滤波器类型: 数据,信号线
线路数: 2
电流: 260mA
DC 电阻(DCR): 最大 600 毫欧
阻抗: 160 欧姆
安装类型: 表面贴装
尺寸/尺寸: 0.047" L x 0.039" W(1.20mm x 1.00mm)
高度(最大): 0.035"(0.90mm)
封装/外壳: 水平式,4 PC 板
工作温度: -40°C ~ 125°C
包装: 标准包装
产品目录页面: 1827 (CN2011-ZH PDF)
其它名称: 587-2414-6
■ PRECAUTIONS
CM04RC, BU05MC, CM01
1. Circuit Design
◆ Operating environment
1. The products described in this speci?cation are intended for use in general electronic equipment, (of ?ce supply equipment, telecommunications systems,
Precautions
measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high
reliability (traf ?c systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where
product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2. PCB Design
Precautions
◆ Land pattern design
1. Please contact any of our of ?ces for a land pattern, and refer to a recommended land pattern of speci?cations.
◆ Land pattern design
Surface Mounting
? Mounting and soldering conditions should be checked beforehand.
? Applicable soldering process to these products is re?ow soldering only.
? Recommended Land Patterns
【 CM04RC 】
( 2 Lines )
( 3 Lines )
( 4 Lines )
【 BU05MC 】
【 CM01 】
Refer to the external dimension
Technical
consider-
1.6
1.6
1.6
0 . 5
0 . 5
drawing for the pin location.
② ① 0.45
ations
6.7
6.7
6.7
1.4
3.2
0.65 1.55
0.45
1.6
1.6
1.6
1.4
0.4 0.3 0.4
1.8 0.74 1.8
1.8 0.74 1.8 0.74 1.8
1.8 0.74 1.8 0.74 1.8 0.74 1.8
1
1
1
1.1
Unit : mm
3. Considerations for automatic placement
◆ Adjustment of mounting machine
Precautions
Technical
consider-
ations
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
◆ Adjustment of mounting machine
1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
4. Soldering
◆ Re?ow soldering
1. Please contact any of our of ?ces for a re?ow soldering, and refer to the recommended condition speci?ed.
2. This product can be used re?ow soldering only.
3. Please do not add any stress to a product until it returns in normal temperature after re?ow soldering.
◆ Lead free soldering
Precautions
Technical
consider-
ations
5. Cleaning
Precautions
1. When using products with lead free soldering, we request to use them after con?rming adhesion, temperature of resistance to soldering heat, soldering etc suf?ciently.
◆ Recommended conditions for using a soldering iron
【 CM04RC, BU05MC 】
? Put the soldering iron on the land-pattern.
? Soldering iron's temperature - Below 350 ℃
? Duration - 3 seconds or less
? The soldering iron should not directly touch the inductor.
【 CM01 】
? Please do not conduct an adjustment with a soldering iron because the wire would be broken due to its thinness.
◆ Re?ow soldering
1. If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products.
◆ Cleaning conditions
1. Please contact any of our of ?ces for a cleaning.
6. Handling
◆ Handling
1. Keep the product away from all magnets and magnetic objects.
◆ Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting product, care should be taken not to give any stresses of de?ection or twisting to the board.
Precautions
Technical
consider-
ations
2. Board separation should not be done manually, but by using the appropriate devices.
◆ Mechanical considerations
1. Please do not give the product any excessive mechanical shocks.
2. Please do not add any shock and power to a product in transportation.
◆ Pick-up pressure
1. Please do not push to add any pressure to a winding part. Please do not give any shock and push onto an exposed part of ferrite cores.
◆ Packing
1. Please avoid accumulation of a packing box as much as possible.
◆ Handling
1. There is a case that a characteristic varies with magnetic in?uence.
◆ Breakaway PC boards (splitting along perforations)
1. The position of the product on PCBs shall be carefully considereed to minimize the stress caused from splitting of the PCBs.
◆ Mechanical considerations
1. There is a case to be damaged by a mechanical shock.
2. There is a case to be broken by the handling in transportation.
◆ Pick-up pressure
1. An excessive shock or stress may cause a damage to the product or a detrioration of a characteristic.
◆ Packing
1. If packing boxes are accumulated, that could cause a deformation on packing tapes or a damage on the products.
7. Storage conditions
◆ Storage
1. To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.
Precautions
Technical
consider-
ations
? Recommended conditions
Ambient temperature : 0 ~ 40 ℃ , Humidity : Below 70% RH
The ambient temperature must be kept below 30 ℃ . Even under ideal storage conditions, the solderability of electrodes may decrease gradually. For this reason,
the products should be used within one year from the time of delivery. In case of storage over 6 months, solderability shall be checked before actual usage.
◆ Storage
1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration
oftaping/packaging materials may take place.
* This catalog contains the typical speci ?cation only due to the limitation of space. When you consider the purchase of our products, please check our speci ?cation.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
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