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参数资料
| 型号： | CM08RB01 |
| 厂商： | Taiyo Yuden |
| 文件页数： | 6/9页 |
| 文件大小： | 0K |
| 描述： | CHOKE COMMON MODE 2500OHMS LEAD |
| 标准包装： | 500 |
| 系列： | CM08RB |
| 滤波器类型： | 电源线 |
| 线路数： | 2 |
| 电感： | 40µH |
| 电流： | 2A |
| DC 电阻(DCR)： | 最大 40 毫欧 |
| 阻抗： | 2.5 千欧 |
| 安装类型： | 通孔 |
| 尺寸/尺寸： | 0.512" L x 0.374" W（13.00mm x 9.50mm） |
| 高度（最大）： | 0.571"（14.50mm） |
| 封装/外壳： | 垂直式，4 PC 引脚 |
| 工作温度： | -25°C ~ 105°C |
| 包装： | 散装 |
13. Solderability
Specified Value
Test Method and
Remarks
BU－RA Type
TLH, TLF Type
TLH, TLF :
Solder temperature
Duration
Immersion depth
TLH, TLF :
Solder temperature
Duration
Immersion depth
At least 75% of terminal electrode is covered by new solder.
At least 90% of terminal electrode is covered by new solder.
: 235±0.5℃
: 2±0.5sec.
: Up to 1.5 to 2.0mm from PBC mounted level.
: 245±5℃
: 4±1sec.
: Up to 1.0 to 1.5mm from PBC mounted level.
14. Resistance to soldering heat
Specified Value
BU－RA Type
TLH, TLF Type
TLH, TLF :
Appearance : No abnormality
Inductance change : Within ±15%
TLF9UA : Inductance change : Within ±5%
TLF14CB : Appearance is no abnormality and within the specified range
Solder temperature
Duration
Immersion depth
Recovery
:
:
:
:
260±5℃
5±0.5sec.
Up to 1.5 to 2.0mm from PBC mounted level.
At least 1hr of recovery under the standard condition after the removal from test chamber, followed by the
Test Method and
Remarks
TLH, TLF :
measurement within 2hrs.
Solder temperature
Duration
Immersion depth
Recovery
:
:
:
:
260±5℃
10±1sec.
Up to 1.0 to 1.5mm from PBC mounted level.
At least 1hr of recovery under the standard condition after the removal from test chamber, followed by the
measurement within 2hrs.
15. Thermal shock
Specified Value
BU－RA Type
TLH, TLF Type
Appearance : No abnormality
Inductance change : Within ±15%
TLF9UA : Inductance change : Within ±15%
TLH, TLF (except TLF9UA) : Withstanding voltage : No abnormality
Insulation resistance : No abnormality
BU-RA,TLH, TLF : According to JIS C 0025
Conditions for 1 cycle
Test Method and
-25℃～+85℃、keep each 30min
Remarks
Number of cycles
Recovery
: 10
: At least 1hr of recovery under the standard condition after the removal from test chamber, followed by the
measurement within 2 hrs.
16. Damp heat
BU－RA Type
Specified Value
TLH, TLF Type
TLF9UA : Inductance change : Within ±15%
TLH, TLF (except TLF9UA) : Withstanding voltage : No abnormality
Insulation resistance : No abnormality
TLH, TLF :
Test Method and
Temperature
:
:
60±2℃
40±2℃ (※except TLF9U)
Remarks
Humidity
Duration
Recovery
:
:
:
90～95％RH
500 hrs
At least 1hr of recovery under the standard removal from test chamber followed by the measurement within 2 hrs.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
coil_leaded_reli_e-E02R01
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相关代理商/技术参数 |
参数描述 |
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| CM08RB02 | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 COMMON MODE CHK COIL RB TYP RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| CM08RB03 | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 COMMON MODE CHK COIL RB TYP RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| CM08RB04 | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 COMMON MODE CHK COIL RB TYP RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| CM08RB05 | 功能描述:电磁干扰滤波珠子、扼流圈和阵列 COMMON MODE CHK COIL RB TYP RoHS:否 制造商:AVX 阻抗: 最大直流电流:35 mA 最大直流电阻: 容差: 端接类型:SMD/SMT 电压额定值:25 V 工作温度范围:- 25 C to + 85 C 封装 / 箱体:0603 (1608 metric) |
| CM08-SLD | 制造商:Custom Connector 功能描述:Conn Relay Socket SKT 8 POS Solder ST SMD |
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