参数资料
型号: CM1220-04CP
厂商: ON Semiconductor
文件页数: 1/6页
文件大小: 0K
描述: TVS ARRAY ESD PROT 4CH 5CSP
产品变化通告: CMD Product Obsolescence 16/Mar/2011
标准包装: 3,500
电压 - 反向隔离(标准值): 6V
电压 - 击穿: 5.6V
电极标记: 4 通道阵列 - 单向
安装类型: 表面贴装
封装/外壳: 5-WFBGA,WLCSP
供应商设备封装: 5-WLCSP(0.96x1.33)
包装: 带卷 (TR)
CM1220
4 and 8-Channel ESD
Protection Arrays in CSP
Description
The CM1220 ESD protection arrays are available in four and eight
channel configurations. Each ESD channel features a nominal
capacitance of 14 pF making the devices ideal for protecting high
speed I/O ports and LCD and camera data lines without significantly
affecting signal integrity. The CM1220 integrates avalanche ? type
ESD diodes on every channel, providing a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). These diodes safely dissipate ESD
strikes of ± 15 kV, exceeding the maximum requirement of the
IEC61000 ? 4 ? 2 international standard. Using the MIL ? STD ? 883
(Method 3015) specification for Human Body Model (HBM) ESD, the
CM1220 protect against contact discharges at greater than ± 30 kV.
These devices are particularly well ? suited for portable electronics
http://onsemi.com
WLCSP5 WLCSP10
CP SUFFIX CP SUFFIX
CASE 567AY CASE 567BL
BLOCK DIAGRAM
(e.g. wireless handsets, PDAs, notebook computers) because of their
A1
A3
C1
C3
small package and easy ? to ? use pin assignments. In particular, the
CM1220 is ideal for protecting high speed I/O ports and data and
control lines for the LCD display and camera interface in mobile
handsets.
The CM1220 incorporates ON Semiconductor ’s OptiGuard t
coating for improved reliability at assembly in a space ? saving,
B2
GND
CM1220 ? 04
low ? profile Chip Scale Package.
A1
A 3
A 5
A7
C1
C3
C5
C7
J
Features
? Four and Eight Channels of ESD Protection
? OptiGuard t Coated for Improved Reliability
? ± 15 kV ESD Protection on each Channel (IEC 61000 ? 4 ? 2 Level 4,
contact discharge)
? ± 30 kV ESD Protection on each Channel (HBM)
? Chip Scale Package (CSP) Features Extremely Low Lead Inductance
for Optimum ESD Protection
? 5 bump, 0.960 mm X 1.330 mm CSP Footprint for CM1220 ? 04
? 10 bump, 1.960 mm X 1.330 mm CSP Footprint for CM1220 ? 08
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? LCD and Camera Data Lines in Mobile Handsets
? I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs, etc.
? Keypads and Buttons
? Wireless Handsets
? Handheld PCs/PDAs
? LCD and Camera Modules
B1, B2
GND
CM1220 ? 08
MARKING DIAGRAM
L208
CM1220 ? 04 CM1220 ? 08
5 ? Bump CSP Package 10 ? Bump CSP Package
J = CM1220 ? 04CP
L208 = CM1220 ? 08CP
ORDERING INFORMATION
Device Package Shipping ?
CM1220 ? 04CP CSP ? 5 3500/Tape & Reel
(Pb ? Free)
CM1220 ? 08CP CSP ? 10 3500/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2011
February, 2011 ? Rev. 3
1
Publication Order Number:
CM1220/D
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