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参数资料
| 型号： | CM1225-04DE |
| 厂商： | ON Semiconductor |
| 文件页数： | 8/8页 |
| 文件大小： | 0K |
| 描述： | TVS ARRAY ESD LOW PROT 4CH 10DFN |
| 产品变化通告： | Product Obsolescence 30/Jun/2011 |
| 标准包装： | 3,000 |
| 电压 - 反向隔离（标准值）： | 1.2V |
| 电压 - 击穿： | 5.5V |
| 电极标记： | 4 通道阵列 - 双向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 10-UFDFN |
| 供应商设备封装： | 10-UDFN（2.5x1） |
| 包装： | 带卷 (TR) |
CM1225
PACKAGE DIMENSIONS
UDFN10 2.5x1, 0.5P
CASE 517BB ? 01
ISSUE O
2X
PIN ONE
REFERENCE
0.10 C
D
A B
E
L1
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
MILLIMETERS
DIM
A
MIN
0.45
MAX
0.55
2X
0.10 C
TOP VIEW
EXPOSED Cu
MOLD CMPD
A1
A3
0.00 0.05
0.13 REF
b
0.15
0.25
0.10 C
DETAIL B
A3
A
A3
b2
D
E
e
0.35 0.45
2.50 BSC
1.00 BSC
0.50 BSC
10X
0.08 C
SIDE VIEW
A1
C
SEATING
PLANE
A1
DETAIL B
OPTIONAL
CONSTRUCTION
L
L1
0.30
---
0.40
0.05
2X
DETAIL A
b2
1
10
5
6
10X
L
RECOMMENDED
SOLDERING FOOTPRINT*
e
8X
b
10X
0.50
2X
0.45
0.10 C A
B
BOTTOM VIEW
0.05 C
NOTE 3
1.30
PACKAGE
OUTLINE
0.50
PITCH
8X 0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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CM1225/D
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