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参数资料
| 型号： | CM1236-08DE |
| 厂商： | ON Semiconductor |
| 文件页数： | 9/9页 |
| 文件大小： | 0K |
| 描述： | ARRAY ESD PROT HI SPD 8CH 16TDFN |
| 标准包装： | 3,000 |
| 系列： | PicoGuard XS® CM1236 |
| 电压 - 反向隔离（标准值）： | 5.5V |
| 电压 - 击穿： | 6V |
| 电极标记： | 8 通道阵列 - 双向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WDFN 裸露焊盘 |
| 供应商设备封装： | 16-WDFN（6x4） |
| 包装： | 带卷 (TR) |
CM1236
PACKAGE DIMENSIONS
WDFN16, 6x4, 0.75P
CASE 511AY ? 01
ISSUE O
2X
PIN ONE
REFERENCE
0.10 C
D
A B
E
L1
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS TH E TERMINALS.
MILLIMETERS
2X 0.10 C
0.10 C
0.08 C
NOTE 4
TOP VIEW
DETAIL B
SIDE VIEW
A1
(A3)
A
C
EXPOSED Cu
SEATING
PLANE
MOLD CMPD
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MIN MAX
0.70 0.80
0.00 0.05
0.20 REF
0.20 0.30
6.00 BSC
5.05 5.15
4.00 BSC
1.75 1.85
0.75 BSC
0.70 REF
0.35 0.45
??? 0.15
DETAIL A
1
D2
8
16X
L
E2
RECOMMENDED
SOLDERING FOOTPRINT*
K
16
e
e/2
9
16X
b
0.10 C A B
0.05 C NOTE 3
5.26
16X
0.63
BOTTOM VIEW
1.96
4.30
16X
0.32
0.75
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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CM1236/D
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