参数资料
型号: CM1406-08DE
厂商: ON Semiconductor
文件页数: 11/12页
文件大小: 0K
描述: ARRAY ESD/EMI FLTR 8CH 16DFN
产品变化通告: Product Obsolescence 30/Jun/2011
标准包装: 3,000
类型: 低通
技术: RC(Pi)
通道数: 8
中心 / 截止频率: 105MHz(截止值)
衰减值: 30dB @ 800MHz ~ 3GHz
电阻 - 通道 (Ohms): 200
值: R = 200 欧姆,C = 15pF
ESD 保护:
滤波器阶数: 2nd
应用: 移动设备的数据线路
封装/外壳: 16-WFDFN 裸露焊盘
尺寸/尺寸: 0.157" L x 0.063" W(4.00mm x 1.60mm)
高度: 0.031"(0.80mm)
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
CM1406
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511BE ? 01
ISSUE O
PIN ONE
REFERENCE
2X 0.10 C
D
A
B
E
L1
L
DETAIL A
ALTERNATE
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
2X 0.10 C
0.10 C
0.08 C
NOTE 4
TOP VIEW
DETAIL B
A1
SIDE VIEW
A
A3
C
EXPOSED Cu
SEATING
PLANE
MOLD CMPD
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MIN MAX
0.70 0.80
0.00 0.05
0.20 REF
0.20 0.30
2.00 BSC
1.50 1.70
2.00 BSC
0.80 1.00
0.50 BSC
0.25 REF
0.20 0.40
??? 0.15
DETAIL A
1
D2
4
8X
L
1.70
PACKAGE 0.50
E2
RECOMMENDED
SOLDERING FOOTPRINT*
8X
OUTLINE
e
8
5
8X
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
1.00
2.30
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
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