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参数资料
| 型号： | CM1457-08CP |
| 厂商： | ON Semiconductor |
| 文件页数： | 7/7页 |
| 文件大小： | 0K |
| 描述： | 8 CH. L-C FILTER W/ESD WLCSP20 |
| 标准包装： | 3,500 |
| 系列： | Praetorian III® |
| 类型： | 低通 |
| 技术： | LC（Pi） |
| 通道数： | 8 |
| 中心 / 截止频率： | 300MHz（截止值） |
| 衰减值： | 35dB @ 800MHz ~ 2.7GHz |
| 电阻 - 通道 (Ohms)： | 45 |
| 电流： | 15mA |
| 值： | L = 70nH（总计），C = 20pF |
| ESD 保护： | 是 |
| 滤波器阶数： | 5th |
| 应用： | 移动设备的数据线路 |
| 封装/外壳： | 20-WFBGA，WLCSP |
| 尺寸/尺寸： | 0.129" L x 0.041" W（3.27mm x 1.05mm） |
| 高度： | 0.027"（0.69mm） |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
CM1457
PACKAGE DIMENSIONS
WLCSP20, 3.27x1.05
CASE 567BV ? 01
ISSUE O
PIN A1
REFERENCE
D
A
B
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
2X
2X
0.05 C
0.05 C
0.05 C
TOP VIEW
OptiGuard Option
A2
DIM
A
A1
A2
b
D
E
eD
eE
MIN MAX
0.54 0.69
0.17 0.24
0.42 REF
0.24 0.29
3.27 BSC
1.05 BSC
0.400 BSC
0.347 BSC
A
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
eD/2
20X b
0.05 C A B
0.03 C
C
B
eD
eE
A
1 2 3
4 5 6
7 8 9
10 1112
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.35
A1
PACKAGE
OUTLINE
0.35
0.40
PITCH
20X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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CM1457/D
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