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| 型号： | CM1693-06DE |
| 厂商： | ON Semiconductor |
| 文件页数： | 8/8页 |
| 文件大小： | 0K |
| 描述： | 6 CH. L-C FILTER W/ESD UDFN12 |
| 产品变化通告： | Product Obsolescence 30/Jun/2011 |
| 标准包装： | 3,000 |
| 系列： | Praetorian® |
| 类型： | 低通 |
| 技术： | LC（Pi） |
| 通道数： | 6 |
| 衰减值： | 30dB @ 800MHz ~ 6GHz |
| 电流： | 30mA |
| 值： | L = 26nH（总计），C = 22pF（总计） |
| ESD 保护： | 是 |
| 滤波器阶数： | 3rd |
| 应用： | 移动设备的数据线路 |
| 封装/外壳： | 12-UFDFN 裸露焊盘 |
| 尺寸/尺寸： | 0.098" L x 0.053" W（2.50mm x 1.35mm） |
| 高度： | 0.022"（0.55mm） |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
CM1693 ? 04DE, CM1693 ? 06DE, CM1693 ? 08DE
PACKAGE DIMENSIONS
UDFN16, 3.3x1.35, 0.4P
CASE 517BE ? 01
ISSUE O
2X
0.10 C
PIN ONE
REFERENCE
D
A
B
E
L1
L
DETAIL A
OPTIONAL
CONSTRUCTIONS
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
OPTIONAL
CONSTRUCTION
2X
0.10 C
0.05 C
16X
0.05 C
NOTE 4
TOP VIEW
DETAIL B
SIDE VIEW
A
A1
(A3)
C
SEATING
PLANE
A1
DETAIL B
EXPOSED Cu MOLD CMPD
A3
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN MAX
0.45 0.55
0.00 0.05
0.13 REF
0.15 0.25
3.30 BSC
2.70 2.90
1.35 BSC
0.30 0.50
0.40 BSC
0.15 ???
0.20 0.30
??? 0.05
16X
L
1
D2
8
DETAIL A
E2
RECOMMENDED
SOLDERING FOOTPRINT*
K
16
e
9
16X
b
0.10 C A B
PACKAGE
OUTLINE
3.00
16X
0.40
BOTTOM VIEW
0.05 C
NOTE 3
1.55
0.50
0.40
PITCH
16X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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CM1693/D
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