参数资料
型号: CM2009-02QR
厂商: ON Semiconductor
文件页数: 4/6页
文件大小: 0K
描述: DIODE VGA PORT COMPANION 16-QSOP
标准包装: 1
电压 - 工作: 6V
电压 - 箝位: 6V
技术: 二极管阵列
功率(瓦特): 500mW
电路数: 1
应用: DVI-I、VGA 端口
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
供应商设备封装: 16-QSOP
包装: 标准包装
其它名称: CM2009-02QROSDKR
CM2009
Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
I CC_VIDEO
I CC_DDC
I CC_SYNC
Parameter
V CC_VIDEO Supply Current
V CC_DDC Supply Current
V CC_SYNC Supply Current
Conditions
V CC_VIDEO = 5.0 V; VIDEO inputs at V CC_VIDEO
or GND
V CC_DDC = 5.0 V
V CC_SYNC = 5 V; SYNC inputs at GND or
V CC_SYNC ; SYNC outputs unloaded
Min
Typ
Max
10
10
50
Units
m A
m A
m A
V CC_SYNC = 5 V; SYNC inputs at 3.0 V;
SYNC outputs unloaded
2.0
mA
V F
V IH
V IL
V OH
V OL
R OUT
R OUT
V OH ? 02
V OL ? 02
ESD Diode Forward Voltage
Logic High Input Voltage
Logic Low Input Voltage
Logic High Output Voltage
Logic Low Output Voltage
SYNC Driver Output Resistance
(CM2009 ? 00 only)
SYNC Driver Output Resistance
(CM2009 ? 02 only)
Logic High Output Voltage
(CM2009 ? 02 only)
Logic Low Output Voltage
(CM2009 ? 02 only)
I F = 10 mA
V CC_SYNC = 5.0 V; (Note 2)
V CC_SYNC = 5.0 V; (Note 2)
I OH = 0 mA, V CC_SYNC = 5.0 V; (Note 2)
I OL = 0 mA, V CC_SYNC = 5.0 V; (Note 2)
V CC_SYNC = 5.0 V; SYNC Inputs at GND or 3.0 V
V CC_SYNC = 5.0 V; SYNC Inputs at GND or 3.0 V;
(Note ?)
I OH = 24 mA; V CC_SYNC = 5.0 V;
(Note 2)
I OL = 24 mA; V CC_SYNC = 5.0 V;
(Note 2)
2.0
4.85
2.0
65
15
1.0
0.6
0.15
0.8
V
V
V
V
V
W
W
V
V
I IN
Input Current
VIDEO Inputs
SYNC_IN1, SYNC_IN2 Inputs
V CC_VIDEO = 5.0 V; V IN = V CC_VIDEO or GND
V CC_SYNC = 5.0 V; V IN = V CC_SYNC or GND
± 1
± 1
m A
m A
I OFF
V ON
C IN_VID
t PLH
t PHL
t R, t F
V ESD
Level Shifting N ? MOSFET ”OFF” State
Leakage Current
Voltage Drop Across Level ? shifting
N ? MOSFET when “ON”
VIDEO Input Capacitance
SYNC Driver L => H Propagation Delay
SYNC Driver H => L Propagation Delay
SYNC Driver Output Rise & Fall Times
ESD Withstand Voltage
(V CC_DDC ? V DDC_IN ) ≤ 0.4 V;
V DDC_OUT = V CC_DDC
(V CC_DDC ? V DDC_OUT ) ≤ 0.4 V;
V DDC_IN = V CC_DDC
V CC_DDC = 2.5 V; V S = GND; I DS = 3 mA;
V CC_VIDEO = 5.0 V; V IN = 2.5 V; f = 1 MHz;
(Note 4)
V CC_VIDEO = 2.5 V; V IN = 1.25 V; f = 1 MHz;
(Note 4)
C L = 50 pF; V CC = 5.0 V; Input t R and t F ≤ 5 ns
C L = 50 pF; V CC = 5.0 V; Input t R and t F ≤ 5 ns
C L = 50 pF; V CC = 5.0 V; Input t R and t F ≤ 5 ns
V CC_VIDEO = V CC_SYNC = 5 V; (Notes 3, 4 & ?)
± 8
4
10
10
0.18
4
4.5
12
12
m A
m A
V
pF
pF
ns
ns
ns
kV
1. All parameters specified over standard operating conditions unless otherwise noted.
2. These parameters apply only to the SYNC drivers. Note that R OUT = R T + R BUFFER .
3. Per the IEC ? 61000 ? 4 ? 2 International ESD Standard, Level 4 contact discharge method. BYP, V CC_VIDEO and V CC_SYNC must be bypassed
to GND via a low impedance ground plane with a 0.2 m F, low inductance, chip ceramic capacitor at each supply pin. ESD pulse is applied
between the applicable pins and GND. ESD pulses can be positive or negative with respect to GND. Applicable pins are: VIDEO_1, VIDEO_2,
VIDEO_3, SYNC_OUT1, SYNC_OUT2, DDC_OUT1 and DDC_OUT2. All other pins are ESD protected to the industry standard ± 2 kV
Human Body Model (MIL ? STD ? 883, Method 3015). The bypass capacitor at the BYP pin may optionally be omitted, in which case the max.
ESD withstand voltage for the DDC_OUT1 and DDC_OUT2 pins is reduced to ± 4 kV.
4. The SYNC_OUT pins on the CM2009 ? 02 are guaranteed for 2 kV HBM ESD protection.
http://onsemi.com
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