参数资料
型号: CM600HA-24A
厂商: Powerex Inc
文件页数: 4/7页
文件大小: 0K
描述: IGBT MOD SGL 1200V 600A A SERIES
标准包装: 1
系列: IGBTMOD™
配置: 单一
电压 - 集电极发射极击穿(最大): 1200V
Vge, Ic时的最大Vce(开): 3V @ 15V,600A
电流 - 集电极 (Ic)(最大): 600A
电流 - 集电极截止(最大): 1mA
Vce 时的输入电容 (Cies): 105nF @ 10V
功率 - 最大: 3670W
输入: 标准
NTC 热敏电阻:
安装类型: 底座安装
封装/外壳: 模块
供应商设备封装: 模块
其它名称: 835-1025
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
CM600HA-24A
Single IGBT A-Series Module
600 Amperes/1200 Volts
Thermal Resistance Characteristics
Characteristics
Thermal Resistance, Junction to Case
Symbol
R th(j-c) Q
Test Conditions
IGBT Part *4
Min.
Typ.
Max.
34
Units
K/kW
Thermal Resistance, Junction to Case
R th(j-c) D
FWDi
Part *4
53
K/kW
Contact Thermal Resistance,
R th(c-f)
Thermal Grease Applied,
15
K/kW
Case to Heatsink
Mechanical Characteristics
Per 1
Module *4,*7
Mounting Torque
Mounting Torque
Mounting Torque
M t
M t
M s
Main Terminal, M6 Screw
G/E Auxiliary Terminals
Mounting to Heatsink, M6 Screw
17
8
22
22
10
27
26
13
31
in-lb
in-lb
in-lb
Weight
m
480
g
Flatness of Baseplate
e c
On Centerline X, Y *6
± 0
+100
μm
*4 Case temperature (T C ) and heatsink temperature (T s ) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m ? K)].
0
0
21.9
34.6
Tr1 Di1
Tr1 Di1
Di1 Tr1
Di1 Tr1
19.8
32.5
Y
BOTTOM
47.3
Tr1 Di1
Di1 Tr1
44.8
3 mm
X
LABEL SIDE
HEATSINK SIDE
– CONCAVE
Each mark points to the center position of each chip.
Tr1: IGBT Di1: FWDi
4
HEATSINK SIDE
+ CONVEX
06/13 Rev. 2
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CM600HA-24H 功能描述:IGBT MOD SGL 1200V 600A H SER RoHS:否 类别:半导体模块 >> IGBT 系列:IGBTMOD™ 标准包装:10 系列:GenX3™ IGBT 类型:PT 配置:单一 电压 - 集电极发射极击穿(最大):600V Vge, Ic时的最大Vce(开):1.4V @ 15V,100A 电流 - 集电极 (Ic)(最大):430A 电流 - 集电极截止(最大):100µA Vce 时的输入电容 (Cies):31nF @ 25V 功率 - 最大:1000W 输入:标准 NTC 热敏电阻:无 安装类型:底座安装 封装/外壳:SOT-227-4,miniBLOC 供应商设备封装:SOT-227B