参数资料
型号: CMF-SD25A-2
厂商: Bourns Inc.
文件页数: 2/3页
文件大小: 0K
描述: CPTC FUSE RESETTABLE
标准包装: 500
系列: CMF-SD
电流 - 维持(Ih): 130mA
电流 - 跳闸(It): 260mA
电压 - 最大: 230V
跳闸时间: 0.3s
封装/外壳: 4-SMD方块
包装: 带卷 (TR)
Applications
Used as a secondary overcurrent protection
device in:
■ Customer Premise Equipment (CPE)
■ Central Of?ce (CO)
■ Access equipment
CMF-SD Series - Telecom CPTC Resettable Fuses
Product Dimensions
Recommended Pad Layout
A
CMF-SD10
CMF-SD25
B
Dim.
CMF-SD35
CMF-SD50
CMF-SD35A
CMF-SD50A
1
(.354) MAX.
(.281) MAX.
(.425) MAX.
(.355) MAX.
H
B
A
B
9.00
10.80
7.15
8.50
A
3
2
4
F
G
(.402) MAX.
(.319) MAX.
F
G
C
10.20
8.10
C
D
E
E
DIMENSIONS:
MM
(INCHES)
D
D
4.88 - 5.28
(.192 - .208)
3.25 - 3.65
(.128 - .144)
H
COPLANARITY:
0.15
(.006)
C
E
2.41 - 2.61
(.095 - .103)
2.41 - 2.61
(.095 - .103)
1
2
(.020) MAX.
(.020) MAX.
(Reduced value available on request.)
F
0.5
0.5
Packaging Options - Tape and Reel:
CMF-SD10, CMF-SD25, CMF-SD35 & CMF-SD50 = 400
pcs. per reel;
CMF-SD35A & CMF-SD50A = 500 pcs. per reel
G
H
2.5
(.098)
1.0
(.039)
2.5
(.098)
1.0
(.039)
3
CMF-SD10
CMF-SD25
4
CMF-SD35
CMF-SD35A
Solder Re?ow Recommendations
Preheating
300
250
200
150
100
50
0
160–220
Soldering
10–20
Cooling
120
Dim.
A
B
C
D
E
F
G
H
CMF-SD50
10.0
(.394)
8.80
(.346)
3.20
(.126)
2.00
(.079)
2.60
(.102)
5.00
(.197)
7.60
(.299)
10.0
(.394)
CMF-SD50A
8.00
(.315)
7.05
(.278)
2.75
(.108)
2.00
(.079)
2.51
(.099)
3.45
(.136)
5.95
(.234)
8.15
(.321)
Time (seconds)
Solder re?ow
?
Recommended re?ow methods: IR, vapor phase oven, hot air oven.
?
Devices are not designed to be wave soldered to the bottom side of the
board.
?
Gluing the devices is not recommended.
?
Recommended maximum paste thickness is 0.25 mm (.010 inch).
?
Devices can be cleaned using standard industry methods and solvents.
Note:
?
If re?ow temperatures exceed the recommended pro?le, devices may not
meet the performance requirements.
Rework
?
A device should not be reworked.
DIMENSIONS:
MM
(INCHES)
CMF-SD SERIES, REV. O, 05/10
Speci?cations are subject to change without notice.
Customers should verify actual device performance in their speci?c applications.
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