参数资料
| 型号： | CMF-SDP10-2 |
| 厂商： | Bourns Inc. |
| 文件页数： | 2/3页 |
| 文件大小： | 0K |
| 描述： | CPTC FUSE RESET .180A HOLD SMD |
| 标准包装： | 1 |
| 系列： | CMF-SDP |
| 电流 - 维持(Ih)： | 180mA |
| 电流 - 跳闸(It)： | 360mA |
| 电流 - 最大： | 1A |
| 电压 - 最大： | 230V |
| 跳闸时间： | 3.8s |
| 封装/外壳： | 4-SMD方块 |
| 包装： | 标准包装 |
| 其它名称： | CMF-SDP10-2-6 |
CMF-SDP Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
Solder reflow
250
200
150
100
50
0
? Recommended reflow methods: IR, vapor phase oven, hot air oven.
? Devices are not designed to be wave soldered to the bottom side of the
board.
? Gluing the devices is not recommended.
? Recommended maximum paste thickness is 0.25 mm (.010 inch).
? Devices can be cleaned using standard industry methods and solvents.
Note:
? If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
160–220
10–20
120
? A device should not be reworked.
Time (seconds)
Product Dimensions
CMF-SDP07, 10, 25, 35, 50 & 75
CMF-SDP10A, 25A, 35A & 50A
8.75
(.344) MAX.
11.5
(.453)
MAX.
10.2
(402)
MAX.
9.0
(.354)
MAX.
2.6
(.102)
5.0
(.197)
11.0
(.433)
MAX.
2.4
(.094)
3.9
(.154)
0.5
(.020)
2 PLCS.
7.2
(.283)
MAX.
Recommended Pad Layout
9.0
(.354)
Recommended Pad Layout
MAX.
7.2
(.283)
MAX.
7.6
11.0
(.433)
8.75
(.344)
3.9
6.3
(.248)
(.299)
5.0
(.197)
(.154)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
DIMENSIONS =
MM
(INCHES)
8.2
(.323)
3.2
(.126)
2.0
(.079)
2.4
(.094)
Packaging options: TAPE & REEL: 350 pcs. per reel
Packaging options: TAPE & REEL: 400 pcs. per reel
CMF-SDP SERIES, REV. C, 11/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
相关PDF资料 |
PDF描述 |
|---|---|
| 430101-20-0 | TERM BARRIER 20CIRC 1 ROW .4375 |
| 430001-20-0 | TERM BARRIER 20CIRC 1 ROW .4375 |
| 325318-21-0 | TERM BARRIER 21CIRC SGL ROW .325 |
| 325308-21-0 | TERM BARRIER 21CIRC SGL ROW .325 |
| 4116R-1-300 | RES ARRAY 30 OHM 8 RES 16-DIP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CMF-SDP10-2-R6 | 功能描述:CPTC FUSE DUAL .180A 600V RoHS:是 类别:过电压，电流，温度装置 >> PTC 可复位保险丝 系列:CMF-SDP 标准包装:500 系列:PFRA 电流 - 维持(Ih):750mA 电流 - 跳闸(It):1.5A 电流 - 最大:40A 电压 - 最大:60V R最小/最大:0.180 ~ 0.400 欧姆 跳闸时间:6.3s 封装/外壳:径向 - 圆盘形 包装:散装 |
| CMF-SDP10A | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:Telecom CPTC Resettable Fuses |
| CMF-SDP10A-2 | 功能描述:可复位保险丝 Ceramic PTC RoHS:否 制造商:Bourns 电流额定值: 电阻:7.5 Ohms 最大直流电压: 保持电流:0.1 A 安装风格:SMD/SMT 端接类型:SMD/SMT 跳闸电流:0.6 A 引线间隔: 系列:MF-PSHT 工作温度范围:- 40 C to + 125 C |
| CMF-SDP10A-XX-2 | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:Telecom CPTC Resettable Fuses |
| CMF-SDP25 | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:Telecom CPTC Resettable Fuses |
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