参数资料
型号: CMF-SDP75-2
厂商: Bourns Inc.
文件页数: 2/3页
文件大小: 0K
描述: CPTC FUSE RESET .070A HOLD SMD
标准包装: 350
系列: CMF-SDP
电流 - 维持(Ih): 70mA
电流 - 跳闸(It): 150mA
电流 - 最大: 2.5A
电压 - 最大: 230V
跳闸时间: 0.12s
封装/外壳: 4-SMD方块
包装: 带卷 (TR)
CMF-SDP Series - Telecom CPTC Resettable Fuses
Solder Reflow Recommendations
300
Preheating
Soldering
Cooling
Solder reflow
250
200
150
100
50
0
? Recommended reflow methods: IR, vapor phase oven, hot air oven.
? Devices are not designed to be wave soldered to the bottom side of the
board.
? Gluing the devices is not recommended.
? Recommended maximum paste thickness is 0.25 mm (.010 inch).
? Devices can be cleaned using standard industry methods and solvents.
Note:
? If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
160–220
10–20
120
? A device should not be reworked.
Time (seconds)
Product Dimensions
CMF-SDP07, 10, 25, 35, 50 & 75
CMF-SDP10A, 25A, 35A & 50A
8.75
(.344) MAX.
11.5
(.453)
MAX.
10.2
(402)
MAX.
9.0
(.354)
MAX.
2.6
(.102)
5.0
(.197)
11.0
(.433)
MAX.
2.4
(.094)
3.9
(.154)
0.5
(.020)
2 PLCS.
7.2
(.283)
MAX.
Recommended Pad Layout
9.0
(.354)
Recommended Pad Layout
MAX.
7.2
(.283)
MAX.
7.6
11.0
(.433)
8.75
(.344)
3.9
6.3
(.248)
(.299)
5.0
(.197)
(.154)
10.0
(.394)
3.2
(.126)
2.0
(.079)
2.6
(.102)
DIMENSIONS =
MM
(INCHES)
8.2
(.323)
3.2
(.126)
2.0
(.079)
2.4
(.094)
Packaging options: TAPE & REEL: 350 pcs. per reel
Packaging options: TAPE & REEL: 400 pcs. per reel
CMF-SDP SERIES, REV. C, 11/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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