参数资料
| 型号： | CP2-HC055-A1-TG30 |
| 厂商： | 3M |
| 文件页数： | 1/6页 |
| 文件大小： | 0K |
| 描述： | CONN HEADER TYPE-C 55POS GOLD |
| 标准包装： | 810 |
| 系列： | MetPak™ CP2 |
| 连接器类型： | 接头，公引脚 |
| 连接器类型： | C 11 |
| 位置数： | 55 |
| 加载位置的数目： | 全部 |
| 间距： | 0.079"（2.00mm） |
| 行数： | 5 |
| 安装类型： | 通孔 |
| 端子： | 压配式 |
| 连接器用途： | 紧凑型PCI |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 30µin（0.76µm） |
| 包装： | 散装 |
| 额定电流： | 1A |
| 工作温度： | -55°C ~ 125°C |
| 配套产品： | CP2-SC055-1-KR-ND - CONN SOCKET TYPE C 55POS RA CP2-SC055-1-TG30-ND - CONN RCPT TYPE-C 55POS R/A |
| 其它名称： | 04801146409 15020703706 5111990511 51119905113 80001202557 CP2HC055A1TG30 |
3M ? MetPak ? CP2 Press-Fit Header
2 mm Type C, 55 Signal Contacts, Left Guidance
CP2 Series
? 25 mm basic system unit
? CompactPCI ? combines the benefits of PCI
desktop architecture with the ruggedness of the 3U
and 6U IEEE Eurocard form factor popularized by
the VME bus
? Designed according to IEC 61076-4-101 and IEC
917 standards
? 2 mm grid spacing allows for high signal density at
low cost
? “Eye of the Needle” compliant pin press-fit design
reduces manufacturing time and cost
? Feed through termination available for midplane
applications
? Additional grounding rows available for improved
ground bounce and EMI immunity
? See Regulatory Information Appendix (RIA)
for chemical compliance information
Date Modified: April 11, 2007
TS-2034-04
Sheet 1 of 4
Physical
Insulation
Material:
Insulation Flammability:
Contact
Material:
Plating:
Glass Filled Polyester (PBT)
UL 94 V-0
Copper Alloy
See Ordering Information
Mechanical
Mating Force: 0.75 N/contact maximum
Withdrawal Force: 0.15 N/contact minimum
Electrical
Insulation Resistance: 10G Ω (Minimum)
Current Ratings: 1A at +70 ° C
Test Voltage: 750 V AC
Environmental
Temperature Ratings: -55 ° C to +125 ° C
PCB Data
Recommended PCB hole platings:
PCB thickness:
Press-In Force:
Retention Force:
UL File No.: E68080
3
Interconnect Solutions
http://www.3M.com/interconnects/
Cu: .0250 - .050 mm [.001 - .002 in.] and Sn or Sn/Pb: <10 μ m [400 μ "]
1.4 - 5.6 mm [.06 - .22 in.]
26 ± 6N/pin on nominal hole diameter ? 0.6 ± 0.05 mm [? .024 ± .002 in.]
20 ± 5N/pin on nominal hole diameter ? 0.6 ± 0.05 mm [? .024 ± .002 in.]
CompactPCI is a registered trademark of PICMG-PCI Industrial Computer Manufacturers Group, Inc.
MetPak is a trademark of 3M Company.
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
相关PDF资料 |
PDF描述 |
|---|---|
| HM2P09PDR210N9LF | CONN HEADER 55POS TYPE C VERT |
| HM2P07PNU1H5GFLF | CONN HEADER 110POS TYPE A VERT |
| 1-1614971-0 | RES 51.1K OHM 1/8W 0.1% 1206 |
| 1-1614970-0 | RES 3.48K OHM 1/8W 0.1% 1206 |
| 5-1614966-0 | RES 187K OHM 1/8W 0.1% 1206 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CP2-HC055-CES40040 | 制造商:3M Electronic Products Division 功能描述:COMPAK PCI - STD SIGNAL CUSTOM |
| CP2-HC055-E1-FJ | 功能描述:PCI Express / PCI 连接器 COMPAK PCI - STD SIG RoHS:否 制造商:JAE Electronics 系列:MM60 产品类型:PCI Express 位置/触点数量:52 安装角:Right 安装风格:SMD/SMT 端接类型:Solder Pad 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold |
| CP2-HC055-E1-KR | 功能描述:PCI Express / PCI 连接器 55P PRESS-FIT HEADR RoHS:否 制造商:JAE Electronics 系列:MM60 产品类型:PCI Express 位置/触点数量:52 安装角:Right 安装风格:SMD/SMT 端接类型:Solder Pad 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold |
| CP2-HC055-E1-TG30 | 功能描述:PCI Express / PCI 连接器 55P PRESS-FIT HEADR RoHS:否 制造商:JAE Electronics 系列:MM60 产品类型:PCI Express 位置/触点数量:52 安装角:Right 安装风格:SMD/SMT 端接类型:Solder Pad 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold |
| CP2-HC055-F2-G30 | 功能描述:PCI Express / PCI 连接器 2MM PRESS FIT HDR 55 SIG CON RoHS:否 制造商:JAE Electronics 系列:MM60 产品类型:PCI Express 位置/触点数量:52 安装角:Right 安装风格:SMD/SMT 端接类型:Solder Pad 外壳材料:Plastic 触点材料:Copper Alloy 触点电镀:Gold |
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