参数资料
型号: CP2112EK
厂商: Silicon Laboratories Inc
文件页数: 4/22页
文件大小: 0K
描述: KIT EVAL FOR CP2112
产品培训模块: CP21xx USB Bridge
标准包装: 1
主要目的: 接口,USB 2.0 至 SMBus 电桥
嵌入式:
已用 IC / 零件: CP2112
主要属性: 全速(12Mbps)
次要属性: LED 状态指示器
已供物品: 板,缆线,CD
相关产品: 336-2004-5-ND - IC HID USB-TO-SMBUS BRIDGE 24QFN
其它名称: 336-2010
CP2112
12
Rev. 1.2
Figure 4. QFN-24 Recommended PCB Land Pattern
Table 9. QFN-24 PCB Land Pattern Dimensions
Dimension
Min
Max
Dimension
Min
Max
C1
3.90
4.00
X2
2.70
2.80
C2
3.90
4.00
Y1
0.65
0.75
E
0.50 BSC
Y2
2.70
2.80
X1
0.20
0.30
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
3. All metal pads are to be non-solder-mask defined (NSMD). Clearance between the solder
mask and the metal pad is to be 60 m minimum, all the way around the pad.
Stencil Design
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch should be used for the center
pad.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for small
body components.
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相关代理商/技术参数
参数描述
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CP2112-F02-FM 制造商:Silicon Labs 功能描述:HID USB-to-SMBus Master,400kHz,OTP,QFN24
CP2112-F02-GM 功能描述:输入/输出控制器接口集成电路 HID USB to SMBUS Bridge RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray
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