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参数资料
| 型号： | CPC1330GRTR |
| 厂商： | CLARE INC |
| 元件分类： | 继电器，输入/输出模块 |
| 中文描述： | TRANSISTOR OUTPUT SOLID STATE RELAY, 5000 V ISOLATION-MAX |
| 封装： | ROHS COMPLIANT, SURFACE MOUNT PACKAGE-4 |
| 文件页数： | 5/7页 |
| 文件大小： | 132K |
| 代理商： | CPC1330GRTR |
CPC1330
www.clare.com
5
R04
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all
of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry
standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to
the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled
according to the limitations and information in that standard as well as to any limitations set forth in the information or
standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1330G / CPC1330GR
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1330G / CPC1330GR
250C for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.
Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy
should not be used.
RoHS
2002/95/EC
e3
Pb
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