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参数资料
| 型号： | CPC1465MTR |
| 厂商： | IXYS Integrated Circuits Division |
| 文件页数： | 7/15页 |
| 文件大小： | 0K |
| 描述： | IC SHDSL/ISDN DC TERM 16-MLP |
| 标准包装： | 1 |
| 功能： | DC 信号终端 |
| 接口： | ISDN，SHDSL |
| 电路数： | 1 |
| 功率（瓦特）： | 1W |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WDFN 裸露焊盘 |
| 供应商设备封装： | 16-MLP（7x6） |
| 包装： | 标准包装 |
| 包括： | 光耦合器 |
| 产品目录页面： | 2629 (CN2011-ZH PDF) |
| 其它名称： | CLA271DKR |
INTEGRATED CIRCUITS DIVISION
R04
www.ixysic.com
15
CPC1465
3.6 Tape and Reel Packaging
3.6.1 CPC1465DTR 16-Pin SOIC Tape & Reel
3.6.2 CPC1465MTR 16-Pin DFN Tape & Reel
Dimensions
mm
(inches)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K
0=3.20
(0.126)
K
1=2.70
(0.106)
A
0=10.90
(0.429)
W=16
(0.630)
B
0=10.70
(0.421)
P=12.00
(0.472)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions
listed on page 5 of EIA-481-2
K
0=1.61 ± 0.10
(0.063 ± 0.004)
A
0=6.24 ± 0.10
(0.246 ± 0.004)
B
0=7.24 ± 0.10
(0.285 ± 0.004)
P=12.00 ± 0.10
(0.472 ± 0.004)
W=16.00 ± 0.30
(0.630 ± 0.012)
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
DIMENSIONS
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1465-R04
Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/2/2013
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