参数资料
型号: CPC1718J
厂商: IXYS Integrated Circuits Division
文件页数: 3/7页
文件大小: 0K
描述: RELAY MOSFET 6.75A ISOPLUS-264
产品目录绘图: CPC17(18, 27, 79, 88)J Circuit
标准包装: 25
系列: CPC, OptoMOS®
电路: SPST-NO(1 Form A)
输出类型: DC
导通状态电阻: 75 毫欧
负载电流: 6.75A
输入电压: 1.2VDC
电压 - 负载: 0 ~ 100 V
安装类型: 通孔
端接类型: PC 引脚
封装/外壳: ISOPLUS264?
供应商设备封装: ISOPLUS264?
包装: 管件
继电器类型: 继电器
产品目录页面: 2629 (CN2011-ZH PDF)
其它名称: CLA315
CPC1718J-ND
I NTEGRATED C IRCUITS D IVISION
2 Thermal Characteristics
CPC1718
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
J u n c t i o n T e m p e r a t u r e ( O p e r a t i n g )
Conditions
-
Free Air
-
Symbol
R θ JC
R θ JA
T J
Minimum
-
-
-40
Typical
-
33
-
Maximum
0.3
-
100
Units
°C/W
°C/W
°C
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
R θ CA =
(T J - T A ) I L(99)2
I L2 ? P D(99)
- R θ JC
T J = Junction Temperature (°C), T J ≤ 100°C *
T A = Ambient Temperature (°C)
I L(99) = Load Current with Case Temperature @ 99°C (A DC )
I L = Desired Operating Load Current (A DC ), I L ≤ I L(MAX)
R θ JC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
R θ CA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P D(99) = Maximum power dissipation with case temperature held at 99oC = 3.33W
* Elevated junction temperature reduces semiconductor lifetime.
3
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