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| 型号： | CPC1788J |
| 厂商： | CLARE INC |
| 元件分类： | 继电器，输入/输出模块 |
| 中文描述： | TRANSISTOR OUTPUT SOLID STATE RELAY, 2500 V ISOLATION-MAX |
| 封装： | ROHS COMPLIANT, ISOPLUS264, 4 PIN |
| 文件页数： | 3/7页 |
| 文件大小： | 920K |
| 代理商： | CPC1788J |
PRELIMINARY
3
www.clare.com
R03
CPC1788
2
Thermal Characteristics
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Units
Thermal Resistance (Junction to Case)
-
RθJC
--
0.3
°C/W
Thermal Resistance (Junction to Ambient)
Free Air
RθJA
-33-
°C/W
Junction Temperature (Operating)
-
TJ
-40
-
100
°C
T
J = Junction Temperature (°C), TJ ≤ 100°C *
T
A = Ambient Temperature (°C)
I
L(99) = Load Current with Case Temperature @ 99°C (ADC)
I
L = Desired Operating Load Current (ADC), IL ≤ IL(MAX)
R
θJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/W
R
θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D(99) = Maximum power dissipation with case temperature held at 99C = 3.33W
* Elevated junction temperature reduces semiconductor lifetime.
Heat Sink Rating
R
θCA =
- R
θJC
(T
J - TA) IL(99)
2
I
L
2
P
D(99)
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