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参数资料
| 型号： | CPC1908J |
| 厂商： | IXYS Integrated Circuits Division |
| 文件页数： | 1/7页 |
| 文件大小： | 0K |
| 描述： | RELAY OPTOMOS SP-NO 3.5A I4-PAC |
| 产品目录绘图： | CPC19(77, 78)J, 1908J Circuit |
| 标准包装： | 25 |
| 系列： | CPC, OptoMOS® |
| 电路： | SPST-NO（1 Form A） |
| 输出类型： | AC，DC |
| 导通状态电阻： | 300 毫欧 |
| 负载电流： | 3.5A |
| 输入电压： | 1.2VDC |
| 电压 - 负载： | 0 ~ 60 V |
| 安装类型： | 通孔 |
| 端接类型： | PC 引脚 |
| 封装/外壳： | i4-Pac?-4，隔离 |
| 供应商设备封装： | i4-PAC? |
| 包装： | 管件 |
| 继电器类型： | 继电器 |
| 产品目录页面： | 2629 (CN2011-ZH PDF) |
| 其它名称： | CLA208 CPC1908J-ND |
CPC1908
Single-Pole, Normally Open
I NTEGRATED C IRCUITS D IVISION
Characteristics
Description
i4-PAC? Power Relay
Parameter
Blocking Voltage
Load Current, T A =25°C:
Rating
60
Units
V P
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS? technology, reliability
and compact size to a new family of high-power Solid
State Relays.
With 5°C/W Heat Sink
No Heat Sink
8.5
3.5
A rms / A DC
As part of this family, the CPC1908 single-pole
On-Resistance (max)
R ? JC
Features
0.3
0.35
?
°C/W
normally open (1-Form-A) Solid State Power Relay is
rated for up to 8.5A rms continuous load current with a
5°C/W heat sink.
The CPC1908 employs optically coupled MOSFET
?
?
?
?
?
?
?
?
?
?
8.5A rms Load Current with 5°C/W Heat Sink
Low 0.3 ? On-Resistance
60V P Blocking Voltage
2500V rms Input/Output Isolation
Low Thermal Resistance (0.35 °C/W)
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
technology to provide 2500V rms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED. The combination
of low on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
Applications
soldered onto the Direct Copper Bond (DCB)
?
?
?
?
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
? Multiplexers
? Data Acquisition
? Electronic Switching
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V rms isolation,
but also very low thermal resistance (0.35 °C/W).
Ordering Information
? I/O Subsystems
? Meters (Watt-Hour, Water, Gas)
? Transportation Equipment
Part
CPC1908J
Description
i4-PAC Package (25 per tube)
? Aerospace/Defense
Approvals
? UL 508 Certified Component: File E69938
Switching Characteristics
Form-A
Pin Configuration
I F
90%
e 3
I LOAD
t on
10%
t off
DS-CPC1908-R08
www.ixysic.com
1
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相关代理商/技术参数 |
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|---|---|
| CPC1909 | 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:ISOPLUS⑩-264 Power Relay |
| CPC1909_10 | 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:ISOPLUS?-264 Power Relay |
| CPC1909J | 功能描述:固态继电器-PCB安装 Single Pole Power i4-PAC RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT |
| CPC1916 | 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:OptoMOS? Power SIP Relay |
| CPC1916_10 | 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:OptoMOS? Power SIP Relay |
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